Inventor · disambiguated record
Tadatoshi Danno
Also filed as: DANNO TADATOSHI
52 granted patents·7 pending applications·386 citations·filing 2001–2019
98Inventor score
Top patents by PatentIndex Score
59 records- 0198US6713849B2Semiconductor utilizing grooves in lead and tab portions of lead frame to prevent peel off between the lead frame and the resinHITACHI LTD·Filed 2001·Granted Mar 30, 2004·168 cites·26 claims
- 0292US8053875B2Method of manufacturing a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Nov 8, 2011·11 cites·20 claims
- 0391US7911054B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Mar 22, 2011·12 cites·25 claims
- 0490US7777309B2Amplifier chip mounted on a lead frameRENESAS TECH CORP·Filed 2008·Granted Aug 17, 2010·14 cites·17 claims
- 0588US8592961B2Method of manufacturing a semiconductor deviceDANNO TADATOSHI·Filed 2012·Granted Nov 26, 2013·5 cites·36 claims
- 0688US8581396B2Semiconductor deviceHASEBE HAJIME·Filed 2011·Granted Nov 12, 2013·7 cites·12 claims
- 0788US8513785B2Method of manufacturing a semiconductor deviceDANNO TADATOSHI·Filed 2011·Granted Aug 20, 2013·5 cites·21 claims
- 0886US7919858B2Semiconductor device having lands disposed inward and outward of an area of a wiring board where electrodes are disposedRENESAS ELECTRONICS CORP·Filed 2009·Granted Apr 5, 2011·11 cites·14 claims
- 0985US9806035B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Oct 31, 2017·2 cites·10 claims
- 1085US9024419B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted May 5, 2015·3 cites·15 claims
- 1185US7833833B2Method of manufacturing a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Nov 16, 2010·5 cites·23 claims
- 1284US9425165B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Aug 23, 2016·2 cites·18 claims
- 1384US8044509B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Oct 25, 2011·4 cites·15 claims
- 1484US7518156B2Semiconductor deviceRENESAS TECH CORP·Filed 2003·Granted Apr 14, 2009·22 cites·13 claims
- 1584US7312511B2Semiconductor device with electrically isolated ground structuresRENESAS TECH CORP·Filed 2006·Granted Dec 25, 2007·12 cites·7 claims
- 1683US10115658B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Oct 30, 2018·2 cites·22 claims
- 1783US9196731B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Nov 24, 2015·6 cites·19 claims
- 1883US8912640B2Semiconductor device and method of manufacturing the sameTAKADA KEITA·Filed 2012·Granted Dec 16, 2014·8 cites·9 claims
- 1982US9735127B2Semiconductor device and electronic deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Aug 15, 2017·3 cites·20 claims
- 2078US9496204B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Nov 15, 2016·2 cites·34 claims
- 2178US8126501B2Semiconductor device and electronic deviceDANNO TADATOSHI·Filed 2011·Granted Feb 28, 2012·3 cites·12 claims
- 2278US7425756B2Semiconductor device and electronic deviceRENESAS TECH CORP·Filed 2003·Granted Sep 16, 2008·17 cites·22 claims
- 2377US7282396B2Method of manufacturing a semiconductor device including using a sealing resin to form a sealing bodyRENESAS TECH CORP·Filed 2004·Granted Oct 16, 2007·10 cites·3 claims
- 2476US7709937B2Method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted May 4, 2010·6 cites·11 claims
- 2575US7691677B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2008·Granted Apr 6, 2010·2 cites·5 claims
- 2673US10522446B2Semiconductor device and manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2017·Granted Dec 31, 2019·2 cites·9 claims
- 2772US7937105B2Semiconductor device and electronic deviceRENESAS ELECTRONICS CORP·Filed 2008·Granted May 3, 2011·3 cites·7 claims
- 2870US7998796B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2010·Granted Aug 16, 2011·2 cites·8 claims
- 2970US7220607B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2005·Granted May 22, 2007·4 cites·13 claims
- 3069US10998288B2Method of manufacturing a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2019·Granted May 4, 2021·0 cites·17 claims
- 3169US10347567B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2018·Granted Jul 9, 2019·1 cites·10 claims
- 3269US7608922B2Semiconductor device including amplifier and frequency converterRENESAS TECH CORP·Filed 2005·Granted Oct 27, 2009·3 cites·6 claims
- 3368US10032736B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Jul 24, 2018·2 cites·18 claims
- 3467US10249595B2Method of manufacturing a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Apr 2, 2019·0 cites·3 claims
- 3565US10490486B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Nov 26, 2019·0 cites·9 claims
- 3664US10037932B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Jul 31, 2018·1 cites·10 claims
- 3764US9252088B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2014·Granted Feb 2, 2016·1 cites·15 claims
- 3864US8120174B2Semiconductor device and manufacturing method thereofDANNO TADATOSHI·Filed 2011·Granted Feb 21, 2012·1 cites·13 claims
- 3964US7982301B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Jul 19, 2011·2 cites·7 claims
- 4064US7285444B2Method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Oct 23, 2007·10 cites·13 claims
- 4161US8471379B2Semiconductor deviceDANNO TADATOSHI·Filed 2012·Granted Jun 25, 2013·1 cites·15 claims
- 4260US8981538B2Semiconductor device and a method for manufacturing a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Mar 17, 2015·1 cites·20 claims
- 4360US8115295B2Semiconductor deviceDANNO TADATOSHI·Filed 2011·Granted Feb 14, 2012·1 cites·8 claims
- 4460US6838315B2Semiconductor device manufacturing method wherein electrode members are exposed from a mounting surface of a resin encapsulatorRENESAS TECH CORP·Filed 2001·Granted Jan 4, 2005·9 cites·8 claims
- 4558US2008006916A1Method of Manufacturing a Semiconductor DeviceRENESAS TECH CORP·Filed 2007·Application pending·0 cites
- 4654US8618642B2Semiconductor deviceHASEBE HAJIME·Filed 2011·Granted Dec 31, 2013·0 cites·10 claims
- 4751US7732910B2Lead frame including suspending leads having trenches formed thereinRENESAS TECH CORP·Filed 2007·Granted Jun 8, 2010·0 cites·6 claims
- 4850US10157878B2Semiconductor device and electronic deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Dec 18, 2018·0 cites·10 claims
- 4950US10083898B2Manufacturing method of semiconductor device and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Sep 25, 2018·0 cites·8 claims
- 5050US2006237831A1Semiconductor device and electronic deviceDANNO TADATOSHI·Filed 2006·Application pending·0 cites
Showing the top 50 of 59 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →