Inventor · disambiguated record
Takahiro Eto
Also filed as: ETO TAKAHIRO
8 granted patents·6 pending applications·7 citations·filing 2008–2024
76Inventor score
Top patents by PatentIndex Score
14 records- 0182US9920286B2Cleaning liquid for lithography and method for forming wiringTOKYO OHKA KOGYO CO LTD·Filed 2016·Granted Mar 20, 2018·3 cites·19 claims
- 0265US8206509B2Cleaning liquid for lithography and method for forming wiringETO TAKAHIRO·Filed 2010·Granted Jun 26, 2012·3 cites·5 claims
- 0358US11807792B2Semiconductor processing liquid and method for processing substrateTOKYO OHKA KOGYO CO LTD·Filed 2021·Granted Nov 7, 2023·0 cites·5 claims
- 0458US8802610B2Cleaning liquid and anticorrosive agent comprising a mercapto compound and solventTOKYO OHKA KOGYO CO LTD·Filed 2013·Granted Aug 12, 2014·0 cites·5 claims
- 0557US2024409812A1Treatment liquidTOKYO OHKA KOGYO CO LTD·Filed 2024·Application pending·0 cites
- 0655US11773324B2Semiconductor processing liquid and method for processing substrateTOKYO OHKA KOGYO CO LTD·Filed 2022·Granted Oct 3, 2023·0 cites·5 claims
- 0755US2013172224A1Cleaning liquid, and anticorrosive agentTOKYO OHKA KOGYO CO LTD·Filed 2012·Application pending·0 cites
- 0853US8623236B2Titanium nitride-stripping liquid, and method for stripping titanium nitride coating filmKUMAZAWA AKIRA·Filed 2008·Granted Jan 7, 2014·1 cites·23 claims
- 0952US2025140548A1Processing solution, method for processing substrate, and method for manufacturing semiconductor substrateTOKYO OHKA KOGYO CO LTD·Filed 2024·Application pending·0 cites
- 1052US2025140549A1Processing solution, method for processing substrate, and method for manufacturing semiconductor substrateTOKYO OHKA KOGYO CO LTD·Filed 2024·Application pending·0 cites
- 1149US11385548B2Process liquid and method of processing substrateTOKYO OHKA KOGYO CO LTD·Filed 2020·Granted Jul 12, 2022·0 cites·12 claims
- 1249US2013330927A1Cleaning liquid for lithography and method for forming wiringTOKYO OHKA KOGYO CO LTD·Filed 2013·Application pending·0 cites
- 1336US8354365B2Cleaning liquid for lithography and method for forming wiringTOKYO OHKA KOGYO CO LTD·Filed 2011·Granted Jan 15, 2013·0 cites·3 claims
- 1431US2015368597A1Stripping solution that is used for removal of titanium or a titanium compound and method of wiring formationTOKYO OHKA KOGYO CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →