Inventor · disambiguated record
Takuo Funaya
Also filed as: FUNAYA TAKUO
35 granted patents·9 pending applications·282 citations·filing 1998–2022
97Inventor score
Top patents by PatentIndex Score
44 records- 0194US9502489B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 22, 2016·14 cites·16 claims
- 0291US9711451B2Semiconductor device with coils in different wiring layersRENESAS ELECTRONICS CORP·Filed 2014·Granted Jul 18, 2017·9 cites·19 claims
- 0389US8987861B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Mar 24, 2015·8 cites·20 claims
- 0489US8198140B2Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor packageMURAI HIDEYA·Filed 2010·Granted Jun 12, 2012·14 cites·12 claims
- 0587US8692135B2Wiring board capable of containing functional element and method for manufacturing sameFUNAYA TAKUO·Filed 2009·Granted Apr 8, 2014·25 cites·2 claims
- 0687US7838779B2Wiring board, method for manufacturing same, and semiconductor packageNEC CORP·Filed 2006·Granted Nov 23, 2010·16 cites·11 claims
- 0785US8035217B2Semiconductor device and method for manufacturing sameNEC CORP·Filed 2008·Granted Oct 11, 2011·9 cites·20 claims
- 0884US9219108B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Dec 22, 2015·4 cites·10 claims
- 0983US6576499B2Electronic device assembly and a method of connecting electronic devices constituting the sameNEC CORP·Filed 2001·Granted Jun 10, 2003·25 cites·3 claims
- 1081US10483199B2Semiconductor device with coils in different wiring layersRENESAS ELECTRONICS CORP·Filed 2018·Granted Nov 19, 2019·2 cites·14 claims
- 1181US6798070B2Electronic device assembly and a method of connecting electronic devices constituting the sameNEC CORP·Filed 2000·Granted Sep 28, 2004·23 cites·8 claims
- 1280US7911038B2Wiring board, semiconductor device using wiring board and their manufacturing methodsRENESAS ELECTRONICS CORP·Filed 2007·Granted Mar 22, 2011·7 cites·18 claims
- 1377US9818815B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 14, 2017·2 cites·15 claims
- 1476US9653396B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted May 16, 2017·3 cites·13 claims
- 1576US6078123AStructure and method for mounting a saw deviceNEC CORP·Filed 1998·Granted Jun 20, 2000·51 cites·12 claims
- 1674US10128125B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 13, 2018·1 cites·14 claims
- 1774US10085425B2Electronic apparatus and manufacturing method thereforRENESAS ELECTRONICS CORP·Filed 2015·Granted Oct 2, 2018·2 cites·18 claims
- 1872US7816782B2Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor packageNEC CORP·Filed 2005·Granted Oct 19, 2010·4 cites·21 claims
- 1971US10062642B2Semiconductor device with inductively coupled coilsRENESAS ELECTRONICS CORP·Filed 2017·Granted Aug 28, 2018·1 cites·18 claims
- 2071US9536828B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2012·Granted Jan 3, 2017·3 cites·21 claims
- 2171US6042682AMethod of thermocompression bonding a supporting substrate to a semiconductor bare chipNEC CORP·Filed 1998·Granted Mar 28, 2000·24 cites·34 claims
- 2267US8536691B2Semiconductor device and method for manufacturing the sameKIKUCHI KATSUMI·Filed 2007·Granted Sep 17, 2013·4 cites·25 claims
- 2366US7692297B2Semiconductor device, semiconductor device module and method of manufacturing the semiconductor deviceNEC ELECTRONICS CORP·Filed 2005·Granted Apr 6, 2010·3 cites·14 claims
- 2463US8450843B2Semiconductor device and method for designing the sameSASAKI HIDEKI·Filed 2008·Granted May 28, 2013·2 cites·11 claims
- 2563US7674989B2Wiring board and method for manufacturing the sameNEC ELECTRONICS CORP·Filed 2006·Granted Mar 9, 2010·2 cites·23 claims
- 2658US8043953B2Semiconductor device including an LSI chip and a method for manufacturing the sameNEC CORP·Filed 2008·Granted Oct 25, 2011·1 cites·7 claims
- 2757US10157974B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2017·Granted Dec 18, 2018·0 cites·12 claims
- 2857US9805950B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2017·Granted Oct 31, 2017·0 cites·7 claims
- 2956US12152997B2Method for predicting reliability of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2022·Granted Nov 26, 2024·0 cites·11 claims
- 3056US6313533B1Function element, substrate for mounting function element thereon, and method of connecting them to each otherNEC CORP·Filed 1999·Granted Nov 6, 2001·22 cites·19 claims
- 3155US2018310529A1Electronic apparatus and manufacturing method thereforRENESAS ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 3254US8389414B2Method of manufacturing a wiring boardKIKUCHI KATSUMI·Filed 2011·Granted Mar 5, 2013·0 cites·30 claims
- 3350US8975150B2Semiconductor device manufacturing methodMORI KENTARO·Filed 2011·Granted Mar 10, 2015·0 cites·13 claims
- 3449US7829199B2Solder, and mounted components using the sameNEC CORP·Filed 2005·Granted Nov 9, 2010·0 cites·6 claims
- 3548US2010044845A1Circuit substrate, an electronic device arrangement and a manufacturing process for the circuit substrateNEC CORP·Filed 2007·Application pending·0 cites
- 3647US2009046441A1Wiring board for mounting semiconductor device, manufacturing method of the same, and wiring board assemblyNEC CORP·Filed 2006·Application pending·0 cites
- 3746US6515869B2Supporting substrate for a semiconductor bare chipNEC CORP·Filed 2000·Granted Feb 4, 2003·1 cites·12 claims
- 3846US2010103634A1Functional-device-embedded circuit board, method for manufacturing the same, and electronic equipmentFUNAYA TAKUO·Filed 2008·Application pending·0 cites
- 3945US2010232127A1Wiring board composite body, semiconductor device, and method for manufacturing the wiring board composite body and the semiconductor deviceNEC ELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 4039US11063009B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Jul 13, 2021·0 cites·18 claims
- 4136US2013237055A1Method of redistributing functional elementFUNAYA TAKUO·Filed 2011·Application pending·0 cites
- 4236US2012156453A1Crack reduction at metal/organic dielectric interfaceGONZALEZ MARIO·Filed 2011·Application pending·0 cites
- 4336US2002056922A1Semiconductor device, production method thereof, and coil spring cutting jig and coil spring guiding jig applied theretoNEC CORP·Filed 2001·Application pending·0 cites
- 4434US2006011702A1Solder and packaging therefromFUNAYA TAKUO·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →