Inventor · disambiguated record
Tatsuki Hasegawa
Also filed as: HASEGAWA TATSUKI
2 granted patents·3 pending applications·0 citations·filing 2016–2022
23Inventor score
Files withLINTEC CORP5
Top patents by PatentIndex Score
5 records- 0154US11078388B2Adhesive composition, sealing sheet, and sealed bodyLINTEC CORP·Filed 2017·Granted Aug 3, 2021·0 cites·14 claims
- 0247US2024163977A1Wiring sheet for three-dimensional moldingLINTEC CORP·Filed 2022·Application pending·0 cites
- 0342US2023337331A1Conductive structure, manufacturing method for conductive structure, article including conductive structure, and manufacturing method for article including conductive structureLINTEC CORP·Filed 2021·Application pending·0 cites
- 0435US2018346763A1Adhesive composition, sealing sheet, and sealed bodyLINTEC CORP·Filed 2016·Application pending·0 cites
- 0533US11162003B2Adhesive composition, sealing sheet, and sealed bodyLINTEC CORP·Filed 2016·Granted Nov 2, 2021·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →