Inventor · disambiguated record
Takashi Hisada
Also filed as: HISADA TAKASHI
47 granted patents·8 pending applications·106 citations·filing 2003–2025
97Inventor score
Top patents by PatentIndex Score
55 records- 0198US9859241B1Method of forming a solder bump structureIBM·Filed 2016·Granted Jan 2, 2018·20 cites·13 claims
- 0294US11684988B2Prevention of dripping of material for material injectionIBM·Filed 2022·Granted Jun 27, 2023·1 cites·20 claims
- 0394US11298769B2Prevention of dripping of material for material injectionIBM·Filed 2019·Granted Apr 12, 2022·3 cites·14 claims
- 0492US10615143B2Injection molded solder bumpingIBM·Filed 2018·Granted Apr 7, 2020·3 cites·11 claims
- 0592US10613282B2Fluid control structureIBM·Filed 2018·Granted Apr 7, 2020·8 cites·15 claims
- 0692US9989713B1Fluid control structureIBM·Filed 2017·Granted Jun 5, 2018·8 cites·10 claims
- 0791US10598874B2Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bumpIBM·Filed 2017·Granted Mar 24, 2020·6 cites·15 claims
- 0887US11969828B2Prevention of dripping of material for material injectionIBM·Filed 2023·Granted Apr 30, 2024·0 cites·20 claims
- 0987US10037967B1Injection molded solder bumpingIBM·Filed 2017·Granted Jul 31, 2018·2 cites·20 claims
- 1085US10797011B2Method of forming solder bumpsIBM·Filed 2017·Granted Oct 6, 2020·3 cites·18 claims
- 1185US10741514B2Fabrication of solder balls with injection molded solderIBM·Filed 2019·Granted Aug 11, 2020·2 cites·20 claims
- 1284US11735575B2Bonding of bridge to multiple semiconductor chipsIBM·Filed 2021·Granted Aug 22, 2023·1 cites·16 claims
- 1382US10037958B2Fabrication of solder balls with injection molded solderIBM·Filed 2017·Granted Jul 31, 2018·2 cites·20 claims
- 1482US9837367B1Fabrication of solder balls with injection molded solderIBM·Filed 2016·Granted Dec 5, 2017·2 cites·14 claims
- 1581US11112570B2Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bumpIBM·Filed 2020·Granted Sep 7, 2021·1 cites·20 claims
- 1680US10371907B2Fluid control structureIBM·Filed 2017·Granted Aug 6, 2019·2 cites·20 claims
- 1780US10115692B2Method of forming solder bumpsIBM·Filed 2016·Granted Oct 30, 2018·2 cites·17 claims
- 1878US10991685B2Assembling of chips by stacking with rotationIBM·Filed 2019·Granted Apr 27, 2021·2 cites·25 claims
- 1976US2025062275A1Injection molded solder head with improved sealing performanceIBM·Filed 2024·Application pending·0 cites
- 2074US12142603B2Bonding of bridge to multiple semiconductor chipsIBM·Filed 2023·Granted Nov 12, 2024·0 cites·8 claims
- 2174US12094825B2Interconnection between chips by bridge chipIBM·Filed 2023·Granted Sep 17, 2024·0 cites·25 claims
- 2274US7791209B2Method of underfill air vent for flipchip BGAIBM·Filed 2008·Granted Sep 7, 2010·6 cites·1 claims
- 2373US7273804B2Internally reinforced bond padsIBM·Filed 2005·Granted Sep 25, 2007·6 cites·9 claims
- 2472US10930609B2Method of forming a solder bump structureIBM·Filed 2020·Granted Feb 23, 2021·0 cites·20 claims
- 2572US7489519B1Power and ground ring snake pattern to prevent delamination between the gold plated ring and mold resin for wirebond PBGAIBM·Filed 2008·Granted Feb 10, 2009·8 cites·1 claims
- 2670US10325839B2Reduction of stress in via structureIBM·Filed 2017·Granted Jun 18, 2019·1 cites·18 claims
- 2770US6864578B2Internally reinforced bond padsIBM·Filed 2003·Granted Mar 8, 2005·16 cites·7 claims
- 2868US12166008B2Injection molded solder head with improved sealing performanceIBM·Filed 2021·Granted Dec 10, 2024·0 cites·18 claims
- 2968US11181704B2Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bumpIBM·Filed 2020·Granted Nov 23, 2021·0 cites·20 claims
- 3068US2025259905A1Underfill vacuum processIBM·Filed 2025·Application pending·0 cites
- 3166US12315775B2Underfill vacuum processIBM·Filed 2021·Granted May 27, 2025·0 cites·8 claims
- 3265US11848272B2Interconnection between chips by bridge chipIBM·Filed 2021·Granted Dec 19, 2023·0 cites·9 claims
- 3365US10692829B2Method of forming a solder bump structureIBM·Filed 2019·Granted Jun 23, 2020·0 cites·20 claims
- 3462US10607956B2Method of forming a solder bump structureIBM·Filed 2017·Granted Mar 31, 2020·0 cites·18 claims
- 3561US10833035B2Method of forming solder bumpsIBM·Filed 2018·Granted Nov 10, 2020·0 cites·20 claims
- 3661US10566302B2Fabrication of solder balls with injection molded solderIBM·Filed 2018·Granted Feb 18, 2020·0 cites·20 claims
- 3761US10553553B2Method of forming a solder bump structureIBM·Filed 2017·Granted Feb 4, 2020·0 cites·18 claims
- 3860US12456656B2Multichip interconnect packageIBM·Filed 2022·Granted Oct 28, 2025·0 cites·22 claims
- 3960US11908723B2Silicon handler with laser-release layersIBM·Filed 2021·Granted Feb 20, 2024·0 cites·24 claims
- 4060US10103118B2Fabrication of solder balls with injection molded solderIBM·Filed 2017·Granted Oct 16, 2018·0 cites·14 claims
- 4159US12183708B2Double resist structure for electrodeposition bondingIBM·Filed 2022·Granted Dec 31, 2024·0 cites·16 claims
- 4258US12354983B2Fine-pitch joining pad structureIBM·Filed 2022·Granted Jul 8, 2025·0 cites·24 claims
- 4358US10840202B2Method of forming solder bumpsIBM·Filed 2017·Granted Nov 17, 2020·0 cites·20 claims
- 4457US2024282735A1Solder volume for flip-chip bondingIBM·Filed 2023·Application pending·0 cites
- 4556US10593616B2Reduction of stress in via structureTESSERA INC·Filed 2017·Granted Mar 17, 2020·0 cites·20 claims
- 4656US2019214339A1Reduction of stress in via structureIBM·Filed 2019·Application pending·0 cites
- 4754US11164845B2Resist structure for forming bumpsIBM·Filed 2020·Granted Nov 2, 2021·0 cites·24 claims
- 4854US8952551B2Semiconductor package and method for fabricating the sameHISADA TAKASHI·Filed 2012·Granted Feb 10, 2015·1 cites·11 claims
- 4953US11329018B2Forming of bump structureIBM·Filed 2019·Granted May 10, 2022·0 cites·6 claims
- 5053US2024006371A1Semiconductor device interconnect structureIBM·Filed 2022·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →