Inventor · disambiguated record

Tai-Cheng Hou

Also filed as: Hou tai-cheng

22 granted patents·17 pending applications·5 citations·filing 2019–2025

91Inventor score

Technology areasH10W H10N H10P H01L H10B

Files withUNITED MICROELECTRONICS CORP39

Top patents by PatentIndex Score

39 records

0196US11818960B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Nov 14, 2023·2 cites·9 claims
0287US12349367B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Jul 1, 2025·0 cites·7 claims
0387US2025301662A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
0486US12108681B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Oct 1, 2024·0 cites·9 claims
0585US12014995B2Warpage-reducing semiconductor structure and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jun 18, 2024·1 cites·8 claims
0685US10916694B2Magnetoresistive random access memory (MRAM) deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Feb 9, 2021·2 cites·5 claims
0785US2024423094A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
0883US12471498B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Nov 11, 2025·0 cites·5 claims
0983US2025008743A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
1081US12120962B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2023·Granted Oct 15, 2024·0 cites·5 claims
1180US12300633B2Warpage-reducing semiconductor structure and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2024·Granted May 13, 2025·0 cites·20 claims
1280US12127413B2Magnetoresistive random access memory and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Oct 22, 2024·0 cites·9 claims
1379US2025008842A1Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
1477US11778922B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Oct 3, 2023·0 cites·13 claims
1577US11545522B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 3, 2023·0 cites·8 claims
1676US11785785B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Oct 10, 2023·0 cites·8 claims
1775US11737370B2Magnetoresistive random access memory (MRAM) deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 22, 2023·0 cites·5 claims
1875US11706993B2Method of manufacturing magnetoresistive random access memory (MRAM) deviceUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jul 18, 2023·0 cites·6 claims
1970US11004897B2Magnetoresistive random access memory and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted May 11, 2021·0 cites·7 claims
2070US2025268108A1Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
2169US11871677B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 9, 2024·0 cites·5 claims
2268US12329037B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jun 10, 2025·0 cites·6 claims
2368US12016250B2MRAM structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jun 18, 2024·0 cites·7 claims
2466US11621296B2Magnetoresistive random access memory and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Apr 4, 2023·0 cites·9 claims
2565US11056536B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jul 6, 2021·0 cites·1 claims
2664US11121312B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Sep 14, 2021·0 cites·16 claims
2762US11605777B2MRAM structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Mar 14, 2023·0 cites·18 claims
2861US2025351731A1Method for planarizing surface of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
2960US2025374565A1Mim capacitor structure and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
3060US2025248048A1Embedded memory device and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
3159US2025194118A1Interposer with mim capacitor and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
3259US2025183151A1Mim capacitor disposed in modified dual damascene structure and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
3359US2025142958A1Semiconductor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
3459US2025140666A1Semiconductor package and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
3558US2025079293A1Semiconductor device and fabricating method thereofUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
3658US2025062222A1Semiconductor Device and Fabricating Method ThereofUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
3758US2025212426A1Metal-insulator-metal capacitor structureUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
3857US2025343050A1Method for planarizing surface of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
3957US2025132210A1Semiconductor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →