Inventor · disambiguated record
Tae-Joo Hwang
Also filed as: HWANG TAE-JOO
19 granted patents·4 pending applications·97 citations·filing 2007–2020
93Inventor score
Top patents by PatentIndex Score
23 records- 0197US8736035B2Semiconductor package and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 27, 2014·26 cites·18 claims
- 0295US8022555B2Semiconductor package and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Sep 20, 2011·34 cites·19 claims
- 0389US10475774B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 12, 2019·5 cites·20 claims
- 0487US8421244B2Semiconductor package and method of forming the sameHWANG TAE-JOO·Filed 2010·Granted Apr 16, 2013·7 cites·32 claims
- 0584US10262967B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 16, 2019·4 cites·14 claims
- 0682US9721926B2Semiconductor device having stacked semiconductor chips interconnected via TSV and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 1, 2017·4 cites·27 claims
- 0778US9484292B2Semiconductor package and method of forming the sameHWANG TAE-JOO·Filed 2014·Granted Nov 1, 2016·3 cites·15 claims
- 0871US7612450B2Semiconductor package including dummy board and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Nov 3, 2009·5 cites·21 claims
- 0970US10727199B2Electronic device including semiconductor device packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 28, 2020·1 cites·11 claims
- 1069US10020290B2Semiconductor device having stacked semiconductor chips interconnected via TSVCHOE YEONG HWAN·Filed 2017·Granted Jul 10, 2018·2 cites·20 claims
- 1169US9685400B2Semiconductor package and method of forming the sameHWANG TAE-JOO·Filed 2016·Granted Jun 20, 2017·1 cites·20 claims
- 1265US11309280B2Semiconductor device packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 19, 2022·0 cites·15 claims
- 1364US10665575B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 26, 2020·1 cites·20 claims
- 1464US8178969B2Flip chip packageLEE JONG-JOO·Filed 2009·Granted May 15, 2012·2 cites·19 claims
- 1562US8129221B2Semiconductor package and method of forming the sameHWANG TAE-JOO·Filed 2011·Granted Mar 6, 2012·1 cites·10 claims
- 1658US7821139B2Flip-chip assembly and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 26, 2010·1 cites·8 claims
- 1752US8723315B2Flip chip packageLEE JONG-JOO·Filed 2012·Granted May 13, 2014·0 cites·14 claims
- 1852US2019139939A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 1950US10204885B2Semiconductor package including stacked semiconductor chips electrically connected to redistribution layersSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 12, 2019·0 cites·18 claims
- 2049US7560374B2Mold for forming conductive bump, method of fabricating the mold, and method of forming bump on wafer using the moldSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 14, 2009·0 cites·19 claims
- 2147US2009149016A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2243US2008268579A1Semiconductor chip package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2343US2008258288A1Semiconductor device stack package, electronic apparatus including the same, and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →