Inventor · disambiguated record
Takahiro Iijima
Also filed as: IIJIMA TAKAHIRO
59 granted patents·12 pending applications·1,183 citations·filing 1983–2024
99Inventor score
Files withHONDA MOTOR CO LTD28SHINKO ELECTRIC IND CO20MATSUSHITA ELECTRIC INDUSTRIAL CO LTD7JGC CORP5PANASONIC IP CORP AMERICA3
Top patents by PatentIndex Score
71 records- 0198USD496019SMobile phoneMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Sep 14, 2004·114 cites·1 claims
- 0297USD477581SMobile phone with a cameraMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jul 22, 2003·93 cites·1 claims
- 0395US5643433ALead frame and method for manufacturing sameSHINKO ELECTRIC IND CO·Filed 1993·Granted Jul 1, 1997·162 cites·7 claims
- 0493US7335531B2Semiconductor device package and method of production and semiconductor device of sameSHINKO ELECTRIC IND CO·Filed 2005·Granted Feb 26, 2008·21 cites·10 claims
- 0593US6914322B2Semiconductor device package and method of production and semiconductor device of sameSHINKO ELECTRIC IND CO·Filed 2002·Granted Jul 5, 2005·50 cites·9 claims
- 0692US6013415ARadiation sensitive compositionJSR CORP·Filed 1998·Granted Jan 11, 2000·96 cites·13 claims
- 0792US5909053ALead frame and method for manufacturing sameSHINKO ELECTRIC IND CO·Filed 1996·Granted Jun 1, 1999·111 cites·4 claims
- 0892US4536455ACentrifugally cast double-layer tube with resistance to carbon depositionJGC CORP·Filed 1983·Granted Aug 20, 1985·28 cites·7 claims
- 0989US6921977B2Semiconductor package, method of production of same, and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2003·Granted Jul 26, 2005·36 cites·10 claims
- 1089US6764931B2Semiconductor package, method of manufacturing the same, and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2002·Granted Jul 20, 2004·41 cites·5 claims
- 1186US7314780B2Semiconductor package, method of production of same, and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2005·Granted Jan 1, 2008·12 cites·3 claims
- 1286USD488791SMobile phoneMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Apr 20, 2004·31 cites·1 claims
- 1385US7352060B2Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrateSHINKO ELECTRIC IND CO·Filed 2005·Granted Apr 1, 2008·13 cites·14 claims
- 1484US6828669B2Interconnection substrate having metal columns covered by a resin film, and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2000·Granted Dec 7, 2004·33 cites·3 claims
- 1584USD487071SMobile phoneMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Feb 24, 2004·29 cites·1 claims
- 1683US7033934B2Method of production of semiconductor packageSHINKO ELECTRIC IND CO·Filed 2003·Granted Apr 25, 2006·24 cites·6 claims
- 1783USD436939SMobile phoneMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Jan 30, 2001·28 cites·1 claims
- 1881US11477806B2Communication device, communication system, radio base station, communication control method, and storage mediumHONDA MOTOR CO LTD·Filed 2021·Granted Oct 18, 2022·1 cites·13 claims
- 1981US6891732B2Multilayer circuit board and semiconductor device using the sameSHINKO ELECTRIC IND CO·Filed 2002·Granted May 10, 2005·27 cites·18 claims
- 2081USD487736SMobile phoneMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Mar 23, 2004·25 cites·1 claims
- 2180US6783652B2Process for manufacturing a wiring boardSHINKO ELECTRIC IND CO·Filed 2001·Granted Aug 31, 2004·28 cites·14 claims
- 2279US6828224B2Method of fabricating substrate utilizing an electrophoretic deposition processSHINKO ELECTRIC IND CO·Filed 2002·Granted Dec 7, 2004·23 cites·8 claims
- 2377US11303855B2Display control method, information processing server, and display terminalPANASONIC IP CORP AMERICA·Filed 2020·Granted Apr 12, 2022·1 cites·17 claims
- 2477USD814542SRobotPANASONIC IP MAN CO LTD·Filed 2016·Granted Apr 3, 2018·16 cites·1 claims
- 2577US6340841B2Build-up board package for semiconductor devicesSHINKO ELECTRIC IND CO·Filed 2000·Granted Jan 22, 2002·21 cites·9 claims
- 2677US2025042333A1VehicleHONDA MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 2773US11856334B2Display control method, information processing server, and display terminalPANASONIC IP CORP AMERICA·Filed 2023·Granted Dec 26, 2023·0 cites·1 claims
- 2873US11375163B2Vehicle inspection device and vehicle inspection systemHONDA MOTOR CO LTD·Filed 2020·Granted Jun 28, 2022·1 cites·7 claims
- 2973US5242665ACarbon containing compound treating apparatus with resistance to carbon depositionJGC CORP·Filed 1992·Granted Sep 7, 1993·22 cites·5 claims
- 3069US11647166B2Display control method, information processing server, and display terminalPANASONIC IP CORP AMERICA·Filed 2022·Granted May 9, 2023·0 cites·1 claims
- 3169US7019404B2Multilayered circuit substrate, semiconductor device and method of producing sameSHINKO ELECTRIC IND CO·Filed 2003·Granted Mar 28, 2006·11 cites·10 claims
- 3268USD436090SMobile phoneMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Jan 9, 2001·15 cites·1 claims
- 3366US11945333B2In-vehicle system, vehicle, and communication methodHONDA MOTOR CO LTD·Filed 2020·Granted Apr 2, 2024·0 cites·14 claims
- 3466US7250355B2Multilayered circuit substrate, semiconductor device and method of producing sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Jul 31, 2007·2 cites·6 claims
- 3563US12145501B2VehicleHONDA MOTOR CO LTD·Filed 2019·Granted Nov 19, 2024·0 cites·10 claims
- 3659US11617221B2Communication device, base station, and communication systemHONDA MOTOR CO LTD·Filed 2021·Granted Mar 28, 2023·0 cites·7 claims
- 3757US11869369B2Moving body and method for controlling same, and method for determining priorityHONDA MOTOR CO LTD·Filed 2019·Granted Jan 9, 2024·0 cites·24 claims
- 3857US8741008B2Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing methodMOTONARI MASAYUKI·Filed 2008·Granted Jun 3, 2014·1 cites·10 claims
- 3957US4976932ACarbon containing compound treating apparatus with resistance to carbon depositionJGC CORP·Filed 1987·Granted Dec 11, 1990·17 cites·13 claims
- 4056US11594139B2Management system, control method therefor, and management serverHONDA MOTOR CO LTD·Filed 2019·Granted Feb 28, 2023·0 cites·37 claims
- 4155US12177750B2Communication control device, mobile object, communication control method, and computer-readable storage medium to control, communication path using direct communication between mobile objectsHONDA MOTOR CO LTD·Filed 2021·Granted Dec 24, 2024·0 cites·15 claims
- 4255US11589419B2Communication system, communication device, communication server, computer-readable storage medium and method of controlling a connection between the communication device and an access pointHONDA MOTOR CO LTD·Filed 2020·Granted Feb 21, 2023·0 cites·24 claims
- 4355US11451942B2Communication control device, communication device, communication system, radio base station, communication control method, and storage mediumHONDA MOTOR CO LTD·Filed 2021·Granted Sep 20, 2022·0 cites·12 claims
- 4454US12287410B2Vehicle and vehicle systemHONDA MOTOR CO LTD·Filed 2020·Granted Apr 29, 2025·0 cites·12 claims
- 4554US11770754B2Network management apparatus, network management method, and storage medium for network comprising a plurality of vehicles and plurality of mobile terminalsHONDA MOTOR CO LTD·Filed 2021·Granted Sep 26, 2023·0 cites·13 claims
- 4654US2022358544A1Communication apparatus, computer-readable storage medium, and systemHONDA MOTOR CO LTD·Filed 2022·Application pending·0 cites
- 4753US12236455B2Communication device, computer-readable storage medium, and systemHONDA MOTOR CO LTD·Filed 2021·Granted Feb 25, 2025·0 cites·18 claims
- 4853US11503538B2Communication device, base station, and communication methodHONDA MOTOR CO LTD·Filed 2020·Granted Nov 15, 2022·0 cites·9 claims
- 4951US2023044953A1Information processing device, program, system, and information processing methodHONDA MOTOR CO LTD·Filed 2022·Application pending·0 cites
- 5050US11111018B2Aerial vehicle and control method for aerial vehicleHONDA MOTOR CO LTD·Filed 2019·Granted Sep 7, 2021·0 cites·9 claims
Showing the top 50 of 71 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →