Inventor · disambiguated record
Takeshi Iizumi
Also filed as: IIZUMI TAKESHI
7 granted patents·9 pending applications·9 citations·filing 2003–2021
74Inventor score
Top patents by PatentIndex Score
16 records- 0182US8951813B2Method of polishing a substrate having a film on a surface of the substrate for semiconductor manufacturingEBARA CORP·Filed 2013·Granted Feb 10, 2015·5 cites·20 claims
- 0264US7638030B2Electrolytic processing apparatus and electrolytic processing methodEBARA CORP·Filed 2003·Granted Dec 29, 2009·3 cites·24 claims
- 0362US10500691B2Substrate processing apparatus and substrate processing methodEBARA CORP·Filed 2017·Granted Dec 10, 2019·0 cites·18 claims
- 0457US7578920B2Electrolytic processing methodEBARA CORP·Filed 2004·Granted Aug 25, 2009·1 cites·7 claims
- 0548US11848216B2Cleaning apparatus for cleaning member, substrate cleaning apparatus and cleaning member assemblyEBARA CORP·Filed 2021·Granted Dec 19, 2023·0 cites·13 claims
- 0647US7476303B2Electrolytic processing apparatus and electrolytic processing methodEBARA CORP·Filed 2004·Granted Jan 13, 2009·0 cites·14 claims
- 0745US12343770B2Cleaning device and cleaning methodEBARA CORP·Filed 2021·Granted Jul 1, 2025·0 cites·18 claims
- 0844US2015111314A1A method of polishing a substrate having a film on a surface of the substrate for semiconductor manufacturingEBARA CORP·Filed 2015·Application pending·0 cites
- 0941US2013337586A1Polishing methodEBARA CORP·Filed 2013·Application pending·0 cites
- 1040US2007187257A1Electrolytic processing apparatus and electrolytic processing methodEBARA CORP·Filed 2005·Application pending·0 cites
- 1139US2015017880A1Film-thickness measuring apparatus, film-thickness measuring method, and polishing apparatus having the film-thickness measuring apparatusEBARA CORP·Filed 2014·Application pending·0 cites
- 1238US2007272562A1Electrolytic Processing Apparatus and Electrolytic Processing MethodNOJI IKUTARO·Filed 2004·Application pending·0 cites
- 1338US2007095659A1Electrolytic processing apparatus and electrolytic processing methodYASUDA HOZUMI·Filed 2004·Application pending·0 cites
- 1435US2023139947A1Polishing method, polishing apparatus, and computer-readable storage medium storing programEBARA CORP·Filed 2021·Application pending·0 cites
- 1530US2006144711A1Electrochemical machining device and electrochemical machining methodKOBATA ITSUKI·Filed 2003·Application pending·0 cites
- 1626US2014030826A1Polishing methodOHTA SHINROU·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →