Inventor · disambiguated record
Taisuke Iwai
Also filed as: IWAI TAISUKE
20 granted patents·4 pending applications·140 citations·filing 1998–2017
94Inventor score
Top patents by PatentIndex Score
24 records- 0190US8194407B2Heat radiation material, electronic device and method of manufacturing electronic deviceYAMAGUCHI YOSHITAKA·Filed 2009·Granted Jun 5, 2012·20 cites·7 claims
- 0289US8958207B2Heat radiation material, electronic device and method of manufacturing electronic deviceYAMAGUCHI YOSHITAKA·Filed 2012·Granted Feb 17, 2015·10 cites·7 claims
- 0388US9034687B2Method of manufacturing graphene nanomesh and method of manufacturing semiconductor deviceFUJITSU LTD·Filed 2014·Granted May 19, 2015·8 cites·20 claims
- 0486US8837149B2Electronic component and method of manufacturing electronic componentHIROSE SHINICHI·Filed 2011·Granted Sep 16, 2014·10 cites·12 claims
- 0584US7633148B2Semiconductor device with semiconductor chips mounted on mounting board via conductive anaotubesFUJITSU LTD·Filed 2007·Granted Dec 15, 2009·13 cites·10 claims
- 0681US8749979B2Sheet structure and method of manufacturing sheet structureIWAI TAISUKE·Filed 2009·Granted Jun 10, 2014·12 cites·19 claims
- 0779US9137926B2Electronic device and method of manufacturing the sameFUJITSU LTD·Filed 2012·Granted Sep 15, 2015·5 cites·14 claims
- 0879US6437649B2Microwave amplifierFUJITSU LTD·Filed 2001·Granted Aug 20, 2002·25 cites·5 claims
- 0976US10396009B2Heat dissipation material and method of manufacturing thereof, and electronic device and method of manufacturing thereofFUJITSU LTD·Filed 2017·Granted Aug 27, 2019·2 cites·6 claims
- 1073US9105600B2Sheet structure, method of manufacturing sheet structure, and electronic deviceFUJITSU LTD·Filed 2013·Granted Aug 11, 2015·3 cites·5 claims
- 1167US8029760B2Method of manufacturing carbon nanotubeFUJITSU LTD·Filed 2008·Granted Oct 4, 2011·1 cites·13 claims
- 1263US9635784B2Heat dissipation material and method of manufacturing thereof, and electronic device and method of manufacturing thereofFUJITSU LTD·Filed 2014·Granted Apr 25, 2017·1 cites·5 claims
- 1362US8743546B2Sheet structure and method of manufacturing the sameIWAI TAISUKE·Filed 2008·Granted Jun 3, 2014·3 cites·12 claims
- 1462US6897732B2AmplifierFUJITSU LTD·Filed 2001·Granted May 24, 2005·12 cites·27 claims
- 1559US8735274B2Manufacture method for semiconductor device with bristled conductive nanotubesMIZUKOSHI MASATAKA·Filed 2010·Granted May 27, 2014·1 cites·6 claims
- 1653US8350391B2Sheet structure, semiconductor device and method of growing carbon structureFUJITSU LTD·Filed 2012·Granted Jan 8, 2013·0 cites·7 claims
- 1753US6133594ACompound semiconductor deviceFUJITSU LTD·Filed 1998·Granted Oct 17, 2000·14 cites·11 claims
- 1849US2018158753A1Heat dissipating structure and manufactureFUJITSU LTD·Filed 2017·Application pending·0 cites
- 1948US8258060B2Sheet structure, semiconductor device and method of growing carbon structureKONDO DAIYU·Filed 2010·Granted Sep 4, 2012·0 cites·12 claims
- 2047US2012325454A1Heat dissipating structure and manufacture thereofIWAI TAISUKE·Filed 2012·Application pending·0 cites
- 2145US8853519B2Thermoelectric conversion device and method of manufacturing the same, and electronic apparatusIWAI TAISUKE·Filed 2011·Granted Oct 7, 2014·0 cites·15 claims
- 2243US9537075B2Graphite structure, electronic component and method of manufacturing electronic componentKONDO DAIYU·Filed 2011·Granted Jan 3, 2017·0 cites·14 claims
- 2339US2012153455A1Semiconductor device, cooling device, and cooilng device fabrication methodMIZUNO YOSHIHIRO·Filed 2011·Application pending·0 cites
- 2439US2012236502A1Sheet-shaped structure, method for manufacturing sheet-shaped structure, electronic device, and method for manufacturing electronic deviceYAMAGUCHI YOSHITAKA·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →