Inventor · disambiguated record
Tae Hoan Jang
Also filed as: JANG TAE HOAN
7 granted patents·175 citations·filing 2000–2009
87Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0193US6515356B1Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 4, 2003·79 cites·12 claims
- 0289US7989356B2Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliabilitySTATS CHIPPAC LTD·Filed 2009·Granted Aug 2, 2011·18 cites·24 claims
- 0382US6717248B2Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2002·Granted Apr 6, 2004·27 cites·38 claims
- 0479US6469258B1Circuit board for semiconductor packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Oct 22, 2002·35 cites·44 claims
- 0570US7190071B2Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2004·Granted Mar 13, 2007·13 cites·9 claims
- 0668US7863726B2Integrated circuit package system with package substrate having corner contacts and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Jan 4, 2011·3 cites·13 claims
- 0751US7646105B2Integrated circuit package system with package substrate having corner contactsSTATS CHIPPAC LTD·Filed 2007·Granted Jan 12, 2010·0 cites·26 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →