Inventor · disambiguated record
Takuya Kadoguchi
Also filed as: KADOGUCHI TAKUYA
37 granted patents·10 pending applications·89 citations·filing 2005–2025
96Inventor score
Top patents by PatentIndex Score
47 records- 0191US8884411B2Semiconductor device and manufacturing method thereofKADOGUCHI TAKUYA·Filed 2012·Granted Nov 11, 2014·15 cites·21 claims
- 0286US9960096B2Semiconductor deviceDENSO CORP·Filed 2014·Granted May 1, 2018·9 cites·9 claims
- 0386US8810026B2Semiconductor moduleKADOGUCHI TAKUYA·Filed 2010·Granted Aug 19, 2014·10 cites·11 claims
- 0484US9059145B2Power module, method for manufacturing power module, and molding dieKADOGUCHI TAKUYA·Filed 2012·Granted Jun 16, 2015·8 cites·2 claims
- 0582US9659892B2Semiconductor device and method of manufacturing semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2015·Granted May 23, 2017·4 cites·7 claims
- 0681US8878347B2Power moduleKADOGUCHI TAKUYA·Filed 2011·Granted Nov 4, 2014·6 cites·10 claims
- 0780US10103091B2Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2018·Granted Oct 16, 2018·4 cites·3 claims
- 0877US9847311B2Semiconductor device and manufacturing method for the semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2015·Granted Dec 19, 2017·3 cites·8 claims
- 0977US9224662B2Semiconductor apparatusTOYOTA MOTOR CO LTD·Filed 2014·Granted Dec 29, 2015·4 cites·10 claims
- 1076US9331001B2Semiconductor moduleKADOGUCHI TAKUYA·Filed 2010·Granted May 3, 2016·5 cites·1 claims
- 1176US8742556B2Semiconductor moduleKADOGUCHI TAKUYA·Filed 2012·Granted Jun 3, 2014·4 cites·7 claims
- 1275US11244880B2Semiconductor deviceDENSO CORP·Filed 2020·Granted Feb 8, 2022·1 cites·7 claims
- 1374US10049952B2Method of fabricating a semiconductor module with a inclined groove formed in resin side surfaceTOYOTA MOTOR CO LTD·Filed 2017·Granted Aug 14, 2018·2 cites·6 claims
- 1469US10396008B2Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2017·Granted Aug 27, 2019·2 cites·2 claims
- 1569US9824961B2Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2017·Granted Nov 21, 2017·1 cites·7 claims
- 1666US9312211B2Semiconductor device and manufacturing method thereofKADOGUCHI TAKUYA·Filed 2013·Granted Apr 12, 2016·2 cites·15 claims
- 1765US9236330B2Power moduleKADOGUCHI TAKUYA·Filed 2010·Granted Jan 12, 2016·2 cites·12 claims
- 1865US9006784B2Semiconductor device and manufacturing method thereofOKUMURA TOMOMI·Filed 2014·Granted Apr 14, 2015·3 cites·10 claims
- 1964US9953905B2Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2014·Granted Apr 24, 2018·1 cites·22 claims
- 2064US9824994B2Semiconductor device in which an electrode of a semiconductor element is joined to a joined member and methods of manufacturing the semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2015·Granted Nov 21, 2017·1 cites·7 claims
- 2163US9502326B2Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2015·Granted Nov 22, 2016·1 cites·5 claims
- 2259US10103090B2Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2015·Granted Oct 16, 2018·1 cites·12 claims
- 2354US11545419B2Semiconductor package having an additional material with a comparative tracking index (CTI) higher than that of encapsulant resin material formed between two terminalsTOYOTA MOTOR CO LTD·Filed 2019·Granted Jan 3, 2023·0 cites·5 claims
- 2452US2016225690A1Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2014·Application pending·0 cites
- 2551US2016315037A1Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2014·Application pending·0 cites
- 2649US11195815B2Semiconductor device and manufacturing method thereof with Cu and Sn intermetallic compoundDENSO CORP·Filed 2019·Granted Dec 7, 2021·0 cites·8 claims
- 2748US11201099B2Semiconductor device and method of manufacturing the sameDENSO CORP·Filed 2019·Granted Dec 14, 2021·0 cites·12 claims
- 2848US9831160B2Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2017·Granted Nov 28, 2017·0 cites·3 claims
- 2948US2014145193A1Lead frame and power moduleKADOGUCHI TAKUYA·Filed 2012·Application pending·0 cites
- 3048US2016307829A1Lead frame and power moduleTOYOTA MOTOR CO LTD·Filed 2016·Application pending·0 cites
- 3145US9224663B2Semiconductor deviceKADOGUCHI TAKUYA·Filed 2013·Granted Dec 29, 2015·0 cites·6 claims
- 3244US2016343630A1Semiconductor device and manufacturing method of the sameTOYOTA MOTOR CO LTD·Filed 2014·Application pending·0 cites
- 3344US2025329602A1Semiconductor device and lattice-shaped finRENESAS ELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 3443US9406593B2Lead frame, electric power converting device, semiconductor apparatus and method of manufacturing semiconductor apparatusKADOGUCHI TAKUYA·Filed 2014·Granted Aug 2, 2016·0 cites·8 claims
- 3543US8994167B2Semiconductor deviceKADOGUCHI TAKUYA·Filed 2012·Granted Mar 31, 2015·0 cites·6 claims
- 3641US10950526B2Semiconductor deviceDENSO CORP·Filed 2019·Granted Mar 16, 2021·0 cites·4 claims
- 3741US2007284735A1Semiconductor DeviceTANIDA KAZUMASA·Filed 2005·Application pending·0 cites
- 3841US2008272488A1Semiconductor DeviceROHM CO LTD·Filed 2005·Application pending·0 cites
- 3940US11276627B2Semiconductor deviceDENSO CORP·Filed 2020·Granted Mar 15, 2022·0 cites·6 claims
- 4039US10312211B2Method of manufacturing semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2016·Granted Jun 4, 2019·0 cites·14 claims
- 4139US2016322726A1Terminal connecting structure and semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2014·Application pending·0 cites
- 4238US10546760B2Method of manufacturing semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2018·Granted Jan 28, 2020·0 cites·3 claims
- 4338US9165848B2Semiconductor deviceOHNO HIROTAKA·Filed 2011·Granted Oct 20, 2015·0 cites·6 claims
- 4436US10475727B2Semiconductor device, manufacturing method for semiconductor device, and electrode plateTOYOTA MOTOR CO LTD·Filed 2018·Granted Nov 12, 2019·0 cites·6 claims
- 4536US9711884B2Terminal connection structure and semiconductor apparatusNISHIHATA MASAYOSHI·Filed 2015·Granted Jul 18, 2017·0 cites·4 claims
- 4636US2017162482A1Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2016·Application pending·0 cites
- 4730US9466549B2Semiconductor moduleTOYOTA MOTOR CO LTD·Filed 2016·Granted Oct 11, 2016·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →