Inventor · disambiguated record
Taku Kanaoka
Also filed as: KANAOKA TAKU
10 granted patents·1 pending application·90 citations·filing 2003–2016
88Inventor score
Top patents by PatentIndex Score
11 records- 0193US7342302B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Mar 11, 2008·20 cites·31 claims
- 0292US7759804B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2008·Granted Jul 20, 2010·20 cites·4 claims
- 0389US7102223B1Semiconductor device and a method of manufacturing the sameHITACHI ULSI SYS CO LTD·Filed 2003·Granted Sep 5, 2006·38 cites·34 claims
- 0486US8183691B2Semiconductor device with pads overlapping wiring layers including dummy wiringKANAOKA TAKU·Filed 2010·Granted May 22, 2012·7 cites·9 claims
- 0572US8026163B2Manufacturing method of semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Sep 27, 2011·1 cites·18 claims
- 0668US9735017B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Aug 15, 2017·2 cites·13 claims
- 0759US8691597B2Method for manufacturing a semiconductor device including application of a plating voltageKANAOKA TAKU·Filed 2012·Granted Apr 8, 2014·1 cites·8 claims
- 0857US10199338B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2016·Granted Feb 5, 2019·0 cites·15 claims
- 0956US2014159245A1Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 1053US8029660B2Manufacturing method of semiconductor integrated device with inverting plating cupRENESAS ELECTRONICS CORP·Filed 2008·Granted Oct 4, 2011·1 cites·13 claims
- 1152US8669659B2Semiconductor device and a method of manufacturing the sameKANAOKA TAKU·Filed 2012·Granted Mar 11, 2014·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →