Inventor · disambiguated record
Takeshi Kasai
Also filed as: KASAI TAKESHI
16 granted patents·5 pending applications·607 citations·filing 1999–2025
93Inventor score
Files withGLOBERIDE INC4HITACHI INT ELECTRIC INC3KOKUSAI ELECTRIC CORP3SUMITOMO METAL SMI ELECTRONICS3FUJITSU COMPONENT LTD2
Top patents by PatentIndex Score
21 records- 0198US9708708B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted Jul 18, 2017·465 cites·14 claims
- 0292US11293096B2Substrate processing apparatus, method for manufacturing semiconductor device and vaporizerHITACHI INT ELECTRIC INC·Filed 2018·Granted Apr 5, 2022·8 cites·12 claims
- 0386US10163663B2Substrate processing apparatus, exhaust system and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2017·Granted Dec 25, 2018·5 cites·9 claims
- 0486US6495394B1Chip package and method for manufacturing the sameSUMITOMO METAL SMI ELECTRONICS·Filed 2000·Granted Dec 17, 2002·37 cites·9 claims
- 0582US10876207B2Substrate processing apparatus, liquid precursor replenishment system, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Dec 29, 2020·3 cites·11 claims
- 0678US6249053B1Chip package and method for manufacturing the sameSUMITOMO METAL SMI ELECTRONICS·Filed 1999·Granted Jun 19, 2001·44 cites·4 claims
- 0772US8471809B2Operation body, information-input device, and information terminal deviceSEKI FUJIO·Filed 2007·Granted Jun 25, 2013·9 cites·3 claims
- 0872US8182362B2Golf club headKUSUMOTO HARUNOBU·Filed 2002·Granted May 22, 2012·26 cites·26 claims
- 0971US11970771B2Vaporizer, substrate processing apparatus and method for manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Apr 30, 2024·0 cites·22 claims
- 1068US9616712B2Process for producing rubber wet master batch, rubber composition and tireNAKAYAMA ATSUSHI·Filed 2010·Granted Apr 11, 2017·1 cites·12 claims
- 1160US6620650B2Chip package and method for manufacturing the sameSUMITOMO METAL SMI ELECTRONICS·Filed 2002·Granted Sep 16, 2003·8 cites·5 claims
- 1254US2025191963A1Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1352US2024411959A1Performance evaluation apparatus for vibration proof rubberHONDA MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 1447US9181378B2Modified natural rubber and method of manufacturing the same, rubber composition and tireBRIDGESTONE CORP·Filed 2013·Granted Nov 10, 2015·0 cites·5 claims
- 1545US7590786B2Server system and signal processing unit, server, and chassis thereofFUJITSU COMPONENT LTD·Filed 2004·Granted Sep 15, 2009·0 cites·18 claims
- 1643USD935541SGolf club headGLOBERIDE INC·Filed 2020·Granted Nov 9, 2021·1 cites·1 claims
- 1742US7843433B2Cordless pointing device and information terminal deviceFUJITSU COMPONENT LTD·Filed 2005·Granted Nov 30, 2010·0 cites·3 claims
- 1841US2023001274A1Putter head provided with intermediate memberGLOBERIDE INC·Filed 2020·Application pending·0 cites
- 1939US2022241657A1Golf club comprising golf club headGLOBERIDE INC·Filed 2020·Application pending·0 cites
- 2036US2012108732A1Dispersion liquid of chemical for rubbers, method for producing same, rubber wet master batch containing chemical for rubbers, rubber composition, and tireNAKAYAMA ATSUSHI·Filed 2010·Application pending·0 cites
- 2131USD935540SGolf club headGLOBERIDE INC·Filed 2020·Granted Nov 9, 2021·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →