Inventor · disambiguated record
Takanori Kawashima
Also filed as: KAWASHIMA TAKANORI
35 granted patents·19 pending applications·75 citations·filing 1997–2024
95Inventor score
Top patents by PatentIndex Score
54 records- 0191US8884411B2Semiconductor device and manufacturing method thereofKADOGUCHI TAKUYA·Filed 2012·Granted Nov 11, 2014·15 cites·21 claims
- 0286US8810026B2Semiconductor moduleKADOGUCHI TAKUYA·Filed 2010·Granted Aug 19, 2014·10 cites·11 claims
- 0384US9059145B2Power module, method for manufacturing power module, and molding dieKADOGUCHI TAKUYA·Filed 2012·Granted Jun 16, 2015·8 cites·2 claims
- 0481US8878347B2Power moduleKADOGUCHI TAKUYA·Filed 2011·Granted Nov 4, 2014·6 cites·10 claims
- 0580US10103091B2Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2018·Granted Oct 16, 2018·4 cites·3 claims
- 0677US11450647B2Semiconductor module and semiconductor device including the sameDENSO CORP·Filed 2020·Granted Sep 20, 2022·1 cites·18 claims
- 0776US9331001B2Semiconductor moduleKADOGUCHI TAKUYA·Filed 2010·Granted May 3, 2016·5 cites·1 claims
- 0875US11244880B2Semiconductor deviceDENSO CORP·Filed 2020·Granted Feb 8, 2022·1 cites·7 claims
- 0975US2025062180A1Semiconductor deviceDENSO CORP·Filed 2024·Application pending·0 cites
- 1072US2025069967A1Semiconductor deviceDENSO CORP·Filed 2024·Application pending·0 cites
- 1169US10396008B2Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2017·Granted Aug 27, 2019·2 cites·2 claims
- 1269US9824961B2Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2017·Granted Nov 21, 2017·1 cites·7 claims
- 1368US10903138B2Semiconductor device and method of manufacturing the sameDENSO CORP·Filed 2019·Granted Jan 26, 2021·1 cites·11 claims
- 1465US12368083B2Semiconductor deviceDENSO CORP·Filed 2022·Granted Jul 22, 2025·0 cites·10 claims
- 1565US9236330B2Power moduleKADOGUCHI TAKUYA·Filed 2010·Granted Jan 12, 2016·2 cites·12 claims
- 1664US9953905B2Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2014·Granted Apr 24, 2018·1 cites·22 claims
- 1762US12159810B2Semiconductor deviceDENSO CORP·Filed 2022·Granted Dec 3, 2024·0 cites·10 claims
- 1860US9111911B2Heat sink, and heat sink-equipped electronic component partNIIMI YOSHIKAZU·Filed 2012·Granted Aug 18, 2015·3 cites·9 claims
- 1960US2024421132A1Semiconductor deviceDENSO CORP·Filed 2024·Application pending·0 cites
- 2060US2024258264A1Semiconductor device and method for manufacturing the sameDENSO CORP·Filed 2024·Application pending·0 cites
- 2159US10103090B2Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2015·Granted Oct 16, 2018·1 cites·12 claims
- 2259US2024079383A1Semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 2358US2024186911A1Power control apparatusDENSO CORP·Filed 2024·Application pending·0 cites
- 2457US2024032265A1Power cardDENSO CORP·Filed 2023·Application pending·0 cites
- 2556US2024079372A1Semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 2656US2024079292A1Semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 2753US11444047B2Semiconductor deviceDENSO CORP·Filed 2020·Granted Sep 13, 2022·0 cites·15 claims
- 2853US2024087978A1Semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 2952US11127826B2Semiconductor deviceDENSO CORP·Filed 2020·Granted Sep 21, 2021·0 cites·8 claims
- 3052US2016225690A1Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2014·Application pending·0 cites
- 3151US11430717B2Semiconductor deviceDENSO CORP·Filed 2020·Granted Aug 30, 2022·0 cites·6 claims
- 3251US6090482ASilicone adhesive filmTEIJIN LTD·Filed 1997·Granted Jul 18, 2000·14 cites·2 claims
- 3350US10658261B2Semiconductor deviceDENSO CORP·Filed 2019·Granted May 19, 2020·0 cites·11 claims
- 3449US2020035588A1Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2018·Application pending·0 cites
- 3549US2018286702A1Semiconductor device and method of manufacturing the sameTOYOTA MOTOR CO LTD·Filed 2018·Application pending·0 cites
- 3648US11201099B2Semiconductor device and method of manufacturing the sameDENSO CORP·Filed 2019·Granted Dec 14, 2021·0 cites·12 claims
- 3748US10886207B2Semiconductor deviceDENSO CORP·Filed 2019·Granted Jan 5, 2021·0 cites·10 claims
- 3848US10454375B2Power converterTOYOTA MOTOR CO LTD·Filed 2019·Granted Oct 22, 2019·0 cites·5 claims
- 3948US9831160B2Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2017·Granted Nov 28, 2017·0 cites·3 claims
- 4048US2014145193A1Lead frame and power moduleKADOGUCHI TAKUYA·Filed 2012·Application pending·0 cites
- 4148US2016307829A1Lead frame and power moduleTOYOTA MOTOR CO LTD·Filed 2016·Application pending·0 cites
- 4247US10943877B2Semiconductor deviceDENSO CORP·Filed 2019·Granted Mar 9, 2021·0 cites·16 claims
- 4346US11274972B2Semiconductor deviceDENSO CORP·Filed 2019·Granted Mar 15, 2022·0 cites·17 claims
- 4445US10964630B2Semiconductor device having a conductor plate and semiconductor elementsDENSO CORP·Filed 2019·Granted Mar 30, 2021·0 cites·15 claims
- 4545US2020266130A1Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2020·Application pending·0 cites
- 4644US10699997B2Semiconductor deviceDENSO CORP·Filed 2019·Granted Jun 30, 2020·0 cites·13 claims
- 4743US10861713B2Semiconductor deviceDENSO CORP·Filed 2019·Granted Dec 8, 2020·0 cites·18 claims
- 4842US11107761B2Semiconductor deviceDENSO CORP·Filed 2019·Granted Aug 31, 2021·0 cites·25 claims
- 4941US10978381B2Semiconductor deviceDENSO CORP·Filed 2019·Granted Apr 13, 2021·0 cites·4 claims
- 5041US2019355649A1Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2019·Application pending·0 cites
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →