Inventor · disambiguated record
Tae Hwa Kim
Also filed as: KIM TAE HWA
13 granted patents·11 pending applications·17 citations·filing 2002–2024
86Inventor score
Files withHYUNDAI MOTOR CO LTD10SAMSUNG ELECTRONICS CO LTD7DAEWOO EDUCATIONAL FOUNDATION1FINGRAM CO LTD1HEO BAEK-HO1
Top patents by PatentIndex Score
24 records- 0186US11756915B2Method and structure to control the solder thickness for double sided cooling power moduleHYUNDAI MOTOR CO LTD·Filed 2020·Granted Sep 12, 2023·2 cites·6 claims
- 0285US12027439B2Vehicle power moduleHYUNDAI MOTOR CO LTD·Filed 2022·Granted Jul 2, 2024·1 cites·9 claims
- 0381US11721613B2Power moduleHYUNDAI MOTOR CO LTD·Filed 2021·Granted Aug 8, 2023·1 cites·11 claims
- 0476US10497597B2Electrostatic chuck assembly and substrate processing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 3, 2019·3 cites·18 claims
- 0571US11031314B2Spacer structure for double-sided-cooled power module and method of manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2019·Granted Jun 8, 2021·1 cites·10 claims
- 0668US12243845B2Method and structure to control the solder thickness for double sided cooling power moduleHYUNDAI MOTOR CO LTD·Filed 2023·Granted Mar 4, 2025·0 cites·1 claims
- 0764US9355857B2Substrate manufacturing method and substrate manufacturing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 31, 2016·1 cites·14 claims
- 0864US8120880B2Suspension assembly and actuator having the same in hard disk driveHEO BAEK-HO·Filed 2009·Granted Feb 21, 2012·2 cites·12 claims
- 0961US2025364364A1Power moduleHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 1056US2025159849A1Power module temperature management deviceHYUNDAI MOTOR CO LTD·Filed 2023·Application pending·0 cites
- 1156US2024355705A1Power moduleHYUNDAI MOTOR CO LTD·Filed 2023·Application pending·0 cites
- 1255US9847266B2Method of fabricating semiconductor deviceKIM TAE-HWA·Filed 2016·Granted Dec 19, 2017·1 cites·11 claims
- 1351US7324530B2Routing method based on packet delayDAEWOO EDUCATIONAL FOUNDATION·Filed 2002·Granted Jan 29, 2008·5 cites·9 claims
- 1450US2023282549A1Power module for vehicle and method of manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2022·Application pending·0 cites
- 1547US12308300B2Double-sided cooling type power moduleHYUNDAI MOTOR CO LTD·Filed 2020·Granted May 20, 2025·0 cites·9 claims
- 1646US9258204B2Method and apparatus for deciding network coding method based on link utilizationKOREA ADVANCED INST SCI & TECH·Filed 2014·Granted Feb 9, 2016·0 cites·18 claims
- 1745US2016203996A1Substrate manufacturing method and substrate manufacturing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 1845US2024077199A1Light source module and air conditioning apparatus comprising light source moduleSEOUL VIOSYS CO LTD·Filed 2023·Application pending·0 cites
- 1943US9721762B2Method and system managing execution of preventative maintenance operation in semiconductor manufacturing equipmentSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 1, 2017·0 cites·19 claims
- 2041US2019319998A1Method of controlling transmission rate in streaming, and system thereofFINGRAM CO LTD·Filed 2019·Application pending·0 cites
- 2137US2017115433A1Multilayer optical sheet assemblySANGBO CORP·Filed 2016·Application pending·0 cites
- 2236US2017062190A1Plasma generation apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 2334US2018053661A1Plasma etching apparatus and method of manufacturing a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 2428US2017110291A1Substrate treatment apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →