Inventor · disambiguated record
Taeseong Kim
Also filed as: KIM TAESEONG
32 granted patents·6 pending applications·143 citations·filing 2007–2024
96Inventor score
Top patents by PatentIndex Score
38 records- 0197US9734402B2Eyewear-type terminal and method of controlling the sameLG ELECTRONICS INC·Filed 2015·Granted Aug 15, 2017·45 cites·14 claims
- 0294US11749586B2Semiconductor device including through via structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 5, 2023·3 cites·20 claims
- 0394US9898120B2Watch type mobile terminal and control method for the mobile terminalLG ELECTRONICS INC·Filed 2015·Granted Feb 20, 2018·16 cites·14 claims
- 0492US11295981B2Semiconductor devices including through vias and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 5, 2022·3 cites·20 claims
- 0591US10225819B2Wireless receiver and control method thereofLG ELECTRONICS INC·Filed 2014·Granted Mar 5, 2019·16 cites·13 claims
- 0690US9602641B2Watch type mobile terminalLG ELECTRONICS INC·Filed 2015·Granted Mar 21, 2017·11 cites·19 claims
- 0789US10180663B2Watch type mobile terminal and control method for the mobile terminalLG ELECTRONICS INC·Filed 2015·Granted Jan 15, 2019·8 cites·18 claims
- 0885US9900498B2Glass-type terminal and method for controlling the sameLG ELECTRONICS INC·Filed 2015·Granted Feb 20, 2018·5 cites·13 claims
- 0984US8836142B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 16, 2014·7 cites·16 claims
- 1081US9921073B2Eyewear-type terminal and method for controlling the sameLG ELECTRONICS INC·Filed 2015·Granted Mar 20, 2018·4 cites·12 claims
- 1179US11664316B2Semiconductor devices having penetration vias with portions having decreasing widthsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 30, 2023·1 cites·11 claims
- 1279US10551929B2Mobile terminal and controlling method thereofLG ELECTRONICS INC·Filed 2014·Granted Feb 4, 2020·5 cites·15 claims
- 1378US9847276B2Semiconductor devices having through-electrodes and methods for fabricating the sameKANG PIL-KYU·Filed 2014·Granted Dec 19, 2017·5 cites·14 claims
- 1477US9939642B2Glass type terminal and control method thereofLG ELECTRONICS INC·Filed 2015·Granted Apr 10, 2018·3 cites·20 claims
- 1576US12107109B2Semiconductor device including through via, semiconductor package, and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 1, 2024·0 cites·20 claims
- 1674US10156977B2Watch type terminal and control method thereofLG ELECTRONICS INC·Filed 2015·Granted Dec 18, 2018·2 cites·21 claims
- 1774US10031337B2Glasses-type terminal and method for controlling the sameLG ELECTRONICS INC·Filed 2015·Granted Jul 24, 2018·2 cites·14 claims
- 1873US9710099B2Mobile terminal and method for controlling the sameLG ELECTRONICS INC·Filed 2015·Granted Jul 18, 2017·2 cites·18 claims
- 1971US10734430B2Semiconductor device including through via, semiconductor package, and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 4, 2020·1 cites·11 claims
- 2070US9420082B2Wireless receiver and method for controlling the sameLG ELECTRONICS INC·Filed 2014·Granted Aug 16, 2016·2 cites·33 claims
- 2169US12046538B2Semiconductor device including through via structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 23, 2024·0 cites·20 claims
- 2268US12347781B2Semiconductor devices having penetration viasSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·19 claims
- 2368US9153522B2Semiconductor devices and methods of fabricating the sameMOON KWANGJIN·Filed 2013·Granted Oct 6, 2015·2 cites·28 claims
- 2468US2025062262A1Semiconductor device and data storage system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2567US11626443B2Semiconductor device including through via, semiconductor package, and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 11, 2023·0 cites·8 claims
- 2666US11791211B2Semiconductor devices including through vias and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 17, 2023·0 cites·20 claims
- 2758US12166000B2Semiconductor device including a lower chip including a peripheral circuit and first and second memory chips vertically stacked thereon and data storage system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 10, 2024·0 cites·20 claims
- 2853US2024071841A1Layout method of semiconductor, inspection method of wafer, manufacturing method of the wafer and manufacturing method of multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2951US11133240B2Semiconductor device and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 28, 2021·0 cites·20 claims
- 3051US10409324B2Glass-type terminal and method of controlling the sameLG ELECTRONICS INC·Filed 2014·Granted Sep 10, 2019·0 cites·13 claims
- 3149US11373932B2Semiconductor packages including through holes and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 28, 2022·0 cites·19 claims
- 3248US11955408B2Integrated circuit semiconductor device including through silicon viaSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 9, 2024·0 cites·20 claims
- 3346US9369561B2Mobile terminal and method for controlling the sameLG ELECTRONICS INC·Filed 2015·Granted Jun 14, 2016·0 cites·20 claims
- 3445US9679829B2Semiconductor devices and methods of fabricating the sameMOON KWANGJIN·Filed 2015·Granted Jun 13, 2017·0 cites·15 claims
- 3540US2008068301A1Plasma display device and driving method thereofKIM SEUNGMIN·Filed 2007·Application pending·0 cites
- 3640US2020066682A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 3740US2008122746A1Plasma display panel and driving method thereofKIM SEUNGMIN·Filed 2007·Application pending·0 cites
- 3837US2018108540A1Method of forming an interposer and a method of manufacturing a semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →