Inventor · disambiguated record
Taeyeong Kim
Also filed as: KIM TAEYEONG
20 granted patents·9 pending applications·50 citations·filing 2013–2025
91Inventor score
Top patents by PatentIndex Score
29 records- 0193US10923452B2Substrate bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 16, 2021·7 cites·20 claims
- 0293US9530706B2Semiconductor devices having hybrid stacking structures and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 27, 2016·13 cites·17 claims
- 0390US9070748B2Semiconductor devices having through-vias and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 30, 2015·10 cites·14 claims
- 0489US9653430B2Semiconductor devices having stacked structures and methods for fabricating the sameKIM TAEYEONG·Filed 2015·Granted May 16, 2017·14 cites·20 claims
- 0578US11594443B2Substrate bonding apparatus and method of manufacturing semiconductor device by using the substrate bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 28, 2023·1 cites·19 claims
- 0678US9847276B2Semiconductor devices having through-electrodes and methods for fabricating the sameKANG PIL-KYU·Filed 2014·Granted Dec 19, 2017·5 cites·14 claims
- 0776US12224262B2Substrate bonding apparatus and method of manufacturing semiconductor device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Feb 11, 2025·0 cites·10 claims
- 0870US12456631B2Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 28, 2025·0 cites·20 claims
- 0970US2024361887A1Communication method and device using avatar in virtual spaceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1069US12086393B2Communication method and device using avatar in virtual spaceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 1161US12175023B2Method and device for displaying notification messageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·17 claims
- 1261US11990444B2Substrate bonding apparatus and method of manufacturing semiconductor device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 21, 2024·0 cites·20 claims
- 1360US11721562B2Substrate bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 8, 2023·0 cites·8 claims
- 1460US2025391751A1Printed circuit board and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1555US2024153883A1Device including overlay target structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1655US2025227083A1Electronic device and method for providing virtual spaceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1754US10931482B2Method and apparatus for channel estimation in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 23, 2021·0 cites·20 claims
- 1853US2025181208A1Method and device for displaying information in virtual spaceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1951US12495111B2Electronic device including plurality of displays and method of operating sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·18 claims
- 2050US10950470B2Substrate bonding apparatus and bonding method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 16, 2021·0 cites·12 claims
- 2149US2024061501A1Electronic device and method for providing conversation function using avatarSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2247US11728197B2Wafer to wafer bonding apparatus and wafer to wafer bonding methodSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·19 claims
- 2347US10541837B2Method and apparatus for channel estimation in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 21, 2020·0 cites·16 claims
- 2447US2024062459A1Electronic device and computer-readable storage medium for providing virtual spaceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2546US11922842B2Electronic device having extendable display and method for providing content thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 5, 2024·0 cites·19 claims
- 2646US2017110445A1Semiconductor devices having hybrid stacking structures and methods of fabricating the sameKANG PIL-KYU·Filed 2016·Application pending·0 cites
- 2744US9583373B2Wafer carrier having cavitySAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 28, 2017·0 cites·13 claims
- 2844US2015243637A1Semiconductor devices having through-vias and methods for fabricating the sameKANG PIL-KYU·Filed 2015·Application pending·0 cites
- 2943US10411062B2Substrate bonding apparatus having adsorption sectors with different vacuum pressures and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 10, 2019·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →