Inventor · disambiguated record
Takafumi Kinuta
Also filed as: KINUTA Takafumi
7 granted patents·4 pending applications·12 citations·filing 2014–2022
76Inventor score
Files withSCREEN HOLDINGS CO LTD4MERCK PATENT GMBH3AZ ELECTRONIC MAT (LUXEMBOURG) S A R L2AZ ELECTRONIC MAT LUXEMBOURG SARL1MERCH PATENT GMBH1
Top patents by PatentIndex Score
11 records- 0189US10792712B2Substrate processing method and substrate processing apparatusSCREEN HOLDINGS CO LTD·Filed 2019·Granted Oct 6, 2020·6 cites·17 claims
- 0287US11211241B2Substrate processing method and substrate processing apparatusSCREEN HOLDINGS CO LTD·Filed 2019·Granted Dec 28, 2021·4 cites·14 claims
- 0381US11260431B2Substrate processing method and substrate processing apparatusSCREEN HOLDINGS CO LTD·Filed 2020·Granted Mar 1, 2022·1 cites·18 claims
- 0466US9482952B2Composition for forming topcoat layer and resist pattern formation method employing the sameAZ ELECTRONIC MAT (LUXEMBOURG) S A R L·Filed 2014·Granted Nov 1, 2016·1 cites·10 claims
- 0564US11901173B2Substrate processing methodSCREEN HOLDINGS CO LTD·Filed 2021·Granted Feb 13, 2024·0 cites·15 claims
- 0649US2024174951A1Substrate surface treating solution, and using the same, method for manufacturing cleaned substrate and method for manufacturing deviceMERCK PATENT GMBH·Filed 2022·Application pending·0 cites
- 0744US2023045307A1Replacement liquid of liquid filling between resist patterns, and method for producing resist patterns using the sameMERCH PATENT GMBH·Filed 2020·Application pending·0 cites
- 0839US12068150B2Substrate cleaning solution, and using the same, method for manufacturing cleaned substrate and method for manufacturing deviceMERCK PATENT GMBH·Filed 2019·Granted Aug 20, 2024·0 cites·17 claims
- 0938US2022056383A1Substrate cleaning solution and method for manufacturing deviceMERCK PATENT GMBH·Filed 2019·Application pending·0 cites
- 1031US10435555B2Void forming composition, semiconductor device provided with voids formed using composition, and method for manufacturing semiconductor device using compositionAZ ELECTRONIC MAT LUXEMBOURG SARL·Filed 2015·Granted Oct 8, 2019·0 cites·15 claims
- 1130US2017218227A1Sacrificial film composition, method for preparing same, semiconductor device having voids formed using said composition, and method for manufacturing semiconductor device using said compositionAZ ELECTRONIC MAT (LUXEMBOURG) S A R L·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →