Inventor · disambiguated record
Takashi Kitae
Also filed as: KITAE TAKASHI
43 granted patents·2 pending applications·274 citations·filing 2000–2011
98Inventor score
Files withPANASONIC CORP21MATSUSHITA ELECTRIC INDUSTRIAL CO LTD12KITAE TAKASHI5NAKATANI SEIICHI3KARASHIMA SEIJI1
Top patents by PatentIndex Score
45 records- 0191US7537961B2Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the samePANASONIC CORP·Filed 2007·Granted May 26, 2009·18 cites·9 claims
- 0291US7531387B1Flip chip mounting method and bump forming methodPANASONIC CORP·Filed 2006·Granted May 12, 2009·19 cites·29 claims
- 0389US7714444B2Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the samePANASONIC CORP·Filed 2009·Granted May 11, 2010·9 cites·10 claims
- 0488US7799607B2Process for forming bumps and solder bumpPANASONIC CORP·Filed 2005·Granted Sep 21, 2010·16 cites·21 claims
- 0588US7611040B2Method for forming solder bump and method for mounting semiconductor device using a solder powder resin compositionPANASONIC CORP·Filed 2006·Granted Nov 3, 2009·13 cites·12 claims
- 0683US7759162B2Flip chip mounting process and flip chip assemblyPANASONIC CORP·Filed 2005·Granted Jul 20, 2010·10 cites·3 claims
- 0782US6512183B2Electronic component mounted member and repair method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jan 28, 2003·25 cites·15 claims
- 0881US8283246B2Flip chip mounting method and bump forming methodKITAE TAKASHI·Filed 2011·Granted Oct 9, 2012·4 cites·7 claims
- 0978US7531385B1Flip chip mounting method and method for connecting substratesPANASONIC CORP·Filed 2006·Granted May 12, 2009·7 cites·17 claims
- 1077US8288778B2Semiconductor device having semiconductor elements formed inside a resin film substrateNAKATANI SEIICHI·Filed 2008·Granted Oct 16, 2012·4 cites·23 claims
- 1176US7951700B2Flip chip mounting method and bump forming methodPANASONIC CORP·Filed 2006·Granted May 31, 2011·5 cites·9 claims
- 1276US7713787B2Mounted body and method for manufacturing the samePANASONIC CORP·Filed 2006·Granted May 11, 2010·4 cites·10 claims
- 1375US6853074B2Electronic part, an electronic part mounting element and a process for manufacturing such the articlesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Feb 8, 2005·16 cites·16 claims
- 1475US6510059B2Conductive resin, electronic module using conductive resin, and method of manufacturing electronic moduleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Jan 21, 2003·19 cites·23 claims
- 1574US6521144B2Conductive adhesive and connection structure using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Feb 18, 2003·15 cites·14 claims
- 1672US8039307B2Mounted body and method for manufacturing the samePANASONIC CORP·Filed 2010·Granted Oct 18, 2011·2 cites·19 claims
- 1772US7919357B2Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substratesPANASONIC CORP·Filed 2009·Granted Apr 5, 2011·5 cites·12 claims
- 1872US6675474B2Electronic component mounted member and repair method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jan 13, 2004·14 cites·5 claims
- 1971US8501583B2Method for connecting between substrates, flip-chip mounting structure, and connection structure between substratesKITAE TAKASHI·Filed 2009·Granted Aug 6, 2013·5 cites·11 claims
- 2070US6916433B2Conductive adhesive, apparatus for mounting electronic component, and method for mounting the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jul 12, 2005·17 cites·18 claims
- 2169US7911064B2Mounted body and method for manufacturing the samePANASONIC CORP·Filed 2006·Granted Mar 22, 2011·4 cites·13 claims
- 2269US7875496B2Flip chip mounting method, flip chip mounting apparatus and flip chip mounting bodyPANASONIC CORP·Filed 2006·Granted Jan 25, 2011·5 cites·12 claims
- 2367US7638883B2Flip chip mounting method and bump forming methodPANASONIC CORP·Filed 2008·Granted Dec 29, 2009·3 cites·7 claims
- 2466US8193526B2Transistor having an organic semiconductor with a hollow spaceNAKATANI SEIICHI·Filed 2008·Granted Jun 5, 2012·2 cites·19 claims
- 2566US7921551B2Electronic component mounting methodPANASONIC CORP·Filed 2006·Granted Apr 12, 2011·4 cites·13 claims
- 2664US6666994B2Conductive adhesive and packaging structure using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Dec 23, 2003·9 cites·25 claims
- 2762US8012801B2Flip chip mounting process and flip chip assemblyPANASONIC CORP·Filed 2010·Granted Sep 6, 2011·1 cites·10 claims
- 2862US7640659B2Method for forming conductive pattern and wiring boardPANASONIC CORP·Filed 2005·Granted Jan 5, 2010·2 cites·18 claims
- 2960US7820021B2Flip chip mounting method and method for connecting substratesPANASONIC CORP·Filed 2008·Granted Oct 26, 2010·1 cites·2 claims
- 3059US9426899B2Electronic component assemblyKITAE TAKASHI·Filed 2008·Granted Aug 23, 2016·1 cites·7 claims
- 3158US8097958B2Flip chip connection structure having powder-like conductive substance and method of producing the sameSAWADA SUSUMU·Filed 2007·Granted Jan 17, 2012·2 cites·33 claims
- 3256US7905011B2Bump forming method and bump forming apparatusPANASONIC CORP·Filed 2007·Granted Mar 15, 2011·1 cites·18 claims
- 3356US7151306B2Electronic part, and electronic part mounting element and an process for manufacturing such the articlesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Dec 19, 2006·4 cites·3 claims
- 3454US8887383B2Electrode structure and method for forming bumpTANIGUCHI YASUSHI·Filed 2007·Granted Nov 18, 2014·1 cites·12 claims
- 3549US7732920B2Flip chip mounting body, flip chip mounting method and flip chip mounting apparatusPANASONIC CORP·Filed 2006·Granted Jun 8, 2010·0 cites·6 claims
- 3649US6814893B2Conductive adhesive agent, packaging structure, and method for manufacturing the same structureMATSUSHITA ELECTRIC INDUSTIRAL·Filed 2003·Granted Nov 9, 2004·2 cites·7 claims
- 3748US6620345B2Conductive adhesive agent, packaging structure, and method for manufacturing the same structureMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Sep 16, 2003·2 cites·7 claims
- 3848US2009008776A1Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing MethodKITAE TAKASHI·Filed 2007·Application pending·0 cites
- 3947US6524721B2Conductive adhesive and packaging structure using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 25, 2003·2 cites·19 claims
- 4046US6749774B2Conductive adhesive and connection structure using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jun 15, 2004·1 cites·7 claims
- 4145US8071425B2Flip chip mounting body, flip chip mounting method and flip chip mounting apparatusNAKATANI SEIICHI·Filed 2010·Granted Dec 6, 2011·0 cites·11 claims
- 4245US7640654B2Electronic component transporting methodPANASONIC CORP·Filed 2007·Granted Jan 5, 2010·0 cites·23 claims
- 4342US2009085227A1Flip-chip mounting body and flip-chip mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 4441US8709293B2Flip-chip mounting resin composition and bump forming resin compositionKITAE TAKASHI·Filed 2005·Granted Apr 29, 2014·0 cites·17 claims
- 4541US8297488B2Bump forming method using self-assembling resin and a wall surfaceKARASHIMA SEIJI·Filed 2007·Granted Oct 30, 2012·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →