Inventor · disambiguated record
Tatsuhiko Koide
Also filed as: KOIDE TATSUHIKO
24 granted patents·19 pending applications·125 citations·filing 2003–2025
94Inventor score
Top patents by PatentIndex Score
43 records- 0195US7838425B2Method of treating surface of semiconductor substrateTOSHIBA KK·Filed 2008·Granted Nov 23, 2010·27 cites·9 claims
- 0295US7749909B2Method of treating a semiconductor substrateTOSHIBA KK·Filed 2009·Granted Jul 6, 2010·46 cites·24 claims
- 0392US7985683B2Method of treating a semiconductor substrateTOSHIBA KK·Filed 2010·Granted Jul 26, 2011·13 cites·30 claims
- 0490US9213242B2Substrate processing method and substrate processing apparatusUOZUMI YOSHIHIRO·Filed 2012·Granted Dec 15, 2015·9 cites·23 claims
- 0587US11616120B2Semiconductor substrate, method of manufacturing semiconductor device, and method of manufacturing semiconductor substrateKIOXIA CORP·Filed 2021·Granted Mar 28, 2023·2 cites·7 claims
- 0682US11862484B2Semiconductor manufacturing apparatus and manufacturing method of semiconductor deviceKIOXIA CORP·Filed 2020·Granted Jan 2, 2024·1 cites·8 claims
- 0782US9991111B2Apparatus and method of treating surface of semiconductor substrateTOSHIBA MEMORY CORP·Filed 2017·Granted Jun 5, 2018·2 cites·19 claims
- 0881US9859111B2Apparatus and method of treating surface of semiconductor substrateTOSHIBA MEMORY CORP·Filed 2015·Granted Jan 2, 2018·2 cites·18 claims
- 0981US8097538B2Method of manufacturing semiconductor deviceKOIDE TATSUHIKO·Filed 2010·Granted Jan 17, 2012·7 cites·20 claims
- 1077US8435903B2Semiconductor substrate surface treatment methodOGAWA YOSHIHIRO·Filed 2011·Granted May 7, 2013·4 cites·20 claims
- 1176US11921428B2Substrate processing method and substrate processing apparatusKIOXIA CORP·Filed 2022·Granted Mar 5, 2024·0 cites·6 claims
- 1271US10453729B2Substrate treatment apparatus and substrate treatment methodTOSHIBA MEMORY CORP·Filed 2018·Granted Oct 22, 2019·1 cites·12 claims
- 1368US12243751B2Chemical solution, etching method, and method for manufacturing semiconductor deviceKIOXIA CORP·Filed 2021·Granted Mar 4, 2025·0 cites·18 claims
- 1468US8399357B2Method of manufacturing semiconductor deviceOGAWA YOSHIHIRO·Filed 2011·Granted Mar 19, 2013·2 cites·20 claims
- 1566US2025183049A1Chemical solution, etching method, and method for manufacturing semiconductor deviceKIOXIA CORP·Filed 2025·Application pending·0 cites
- 1662US2019214277A1Substrate processing method and substrate processing apparatusTOSHIBA MEMORY CORP·Filed 2019·Application pending·0 cites
- 1761US6974717B2Solid state image device and including an optical lens and a microlensSANYO ELECTRIC CO·Filed 2003·Granted Dec 13, 2005·8 cites·12 claims
- 1861US2024429075A1Substrate processing apparatus, method for substrate processing, and method for manufacturing semiconductor deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 1957US11929250B2Substrate processing apparatus, substrate processing method and a semiconductor device manufacturing methodKIOXIA CORP·Filed 2022·Granted Mar 12, 2024·0 cites·24 claims
- 2057US2024087918A1Substrate processing apparatus, substrate processing method, and semiconductor device manufacturing methodKIOXIA CORP·Filed 2023·Application pending·0 cites
- 2155US10290491B2Substrate treatment apparatus and substrate treatment methodTOSHIBA MEMORY CORP·Filed 2017·Granted May 14, 2019·0 cites·9 claims
- 2255US2025393211A1Manufacturing method for semiconductor deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 2354US2016071747A1Substrate processing method and substrate processing apparatusTOSHIBA KK·Filed 2015·Application pending·0 cites
- 2453US12500098B2Substrate processing device, substrate processing method, and method for manufacturing semiconductor deviceKIOXIA CORP·Filed 2022·Granted Dec 16, 2025·0 cites·16 claims
- 2553US7129530B2Semiconductor deviceSANYO ELECTRIC CO·Filed 2005·Granted Oct 31, 2006·1 cites·14 claims
- 2653US2023301079A1Semiconductor device and method for manufacturing the sameKIOXIA CORP·Filed 2022·Application pending·0 cites
- 2752US2014213064A1Semiconductor manufacturing apparatus and manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2013·Application pending·0 cites
- 2851US9748091B2Substrate treatment apparatus and substrate treatment methodTOSHIBA MEMORY CORP·Filed 2015·Granted Aug 29, 2017·0 cites·9 claims
- 2950US2023307265A1Substrate processing apparatus and substrate processing methodKIOXIA CORP·Filed 2022·Application pending·0 cites
- 3049US10573508B2Surface treatment apparatus and method for semiconductor substrateTOSHIBA MEMORY CORP·Filed 2015·Granted Feb 25, 2020·0 cites·20 claims
- 3148US2010044343A1Substrate treatment apparatus and substrate treatment methodTOMITA HIROSHI·Filed 2009·Application pending·0 cites
- 3247US2011143541A1Apparatus and method of treating surface of semiconductor substrateOGAWA YOSHIHIRO·Filed 2010·Application pending·0 cites
- 3341US2011139192A1Surface treatment apparatus and method for semiconductor substrateKOIDE TATSUHIKO·Filed 2010·Application pending·0 cites
- 3439US7564075B2Semiconductor deviceSANYO ELECTRIC CO·Filed 2005·Granted Jul 21, 2009·0 cites·11 claims
- 3538US10714328B2Semiconductor manufacturing apparatus and method of manufacturing semiconductor deviceTOSHIBA MEMORY CORP·Filed 2018·Granted Jul 14, 2020·0 cites·6 claims
- 3638US7446009B2Manufacturing method for semiconductor deviceSANYO ELECTRIC CO·Filed 2006·Granted Nov 4, 2008·0 cites·18 claims
- 3738US2015034130A1Method of cleaning semiconductor substrate and apparatus for cleaning semiconductor substrateTOSHIBA KK·Filed 2014·Application pending·0 cites
- 3837US2004061236A1Semiconductor device provided with a dielectric film including porous structure and manufacturing method thereofSANYO ELECTRIC CO·Filed 2003·Application pending·0 cites
- 3937US2008251882A1Semiconductor device and method of fabricating the sameKOIDE TATSUHIKO·Filed 2008·Application pending·0 cites
- 4036US2013196512A1Method and apparatus for manufacturing semiconductor deviceKOIDE TATSUHIKO·Filed 2012·Application pending·0 cites
- 4136US2011220152A1Supercritical drying method and supercritical drying apparatusKITAJIMA YUKIKO·Filed 2010·Application pending·0 cites
- 4233US2006065950A1Semiconductor deviceSANYO ELECTRIC CO·Filed 2005·Application pending·0 cites
- 4331US2011143545A1Apparatus and method of treating surface of semiconductor substrateOKUCHI HISASHI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →