Inventor · disambiguated record
Taeho Kook
Also filed as: KOOK TAEHO
26 granted patents·3 pending applications·738 citations·filing 1989–2017
97Inventor score
Files withAGERE SYSTEMS INC9LUCENT TECHNOLOGIES INC5TRIQUINT SEMICONDUCTOR INC3ABBOTT BENJAMIN P2AT & T BELL LAB2
Top patents by PatentIndex Score
29 records- 0198US7939987B1Acoustic wave device employing reflective elements for confining elastic energyTRIQUINT SEMICONDUCTOR INC·Filed 2008·Granted May 10, 2011·133 cites·24 claims
- 0297US8294331B2Acoustic wave guide device and method for minimizing trimming effects and piston mode instabilitiesABBOTT BENJAMIN P·Filed 2011·Granted Oct 23, 2012·52 cites·26 claims
- 0395US8035464B1Bonded wafer SAW filters and methodsTRIQUINT SEMICONDUCTOR INC·Filed 2009·Granted Oct 11, 2011·46 cites·20 claims
- 0493US5573965AMethod of fabricating semiconductor devices and integrated circuits using sidewall spacer technologyLUCENT TECHNOLOGIES INC·Filed 1993·Granted Nov 12, 1996·114 cites·17 claims
- 0592US7301231B2Reinforced bond pad for a semiconductor deviceAGERE SYSTEMS INC·Filed 2006·Granted Nov 27, 2007·31 cites·7 claims
- 0691US7429502B2Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sinkAGERE SYSTEMS INC·Filed 2007·Granted Sep 30, 2008·23 cites·10 claims
- 0790US7115985B2Reinforced bond pad for a semiconductor deviceAGERE SYSTEMS INC·Filed 2004·Granted Oct 3, 2006·65 cites·10 claims
- 0884US6008123AMethod for using a hardmask to form an opening in a semiconductor substrateLUCENT TECHNOLOGIES INC·Filed 1997·Granted Dec 28, 1999·77 cites·25 claims
- 0983US5057462ACompensation of lithographic and etch proximity effectsAT & T BELL LAB·Filed 1989·Granted Oct 15, 1991·40 cites·12 claims
- 1082US10476481B2Acoustic filtering circuitry including capacitorQORVO US INC·Filed 2017·Granted Nov 12, 2019·4 cites·20 claims
- 1182US8319343B2Routing under bond pad for the replacement of an interconnect layerARCHER III VANCE D·Filed 2006·Granted Nov 27, 2012·13 cites·10 claims
- 1281US7397103B2Semiconductor with damage detection circuitryAGERE SYSTEMS INC·Filed 2005·Granted Jul 8, 2008·11 cites·13 claims
- 1381US5891784ATransistor fabrication methodLUCENT TECHNOLOGIES INC·Filed 1995·Granted Apr 6, 1999·70 cites·6 claims
- 1479US7777333B2Structure and method for fabricating flip chip devicesAGERE SYSTEMS INC·Filed 2006·Granted Aug 17, 2010·9 cites·17 claims
- 1566US7327029B2Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sinkAGERE SYSTEMS INC·Filed 2005·Granted Feb 5, 2008·3 cites·10 claims
- 1662US8044553B2Temperature compensated surface acoustic wave device and method having buried interdigital transducers for providing an improved insertion loss and quality factorTRIQUINT SEMICONDUCTOR INC·Filed 2010·Granted Oct 25, 2011·2 cites·23 claims
- 1760US5589303ASelf-aligned opaque regions for attenuating phase-shifting masksLUCENT TECHNOLOGIES INC·Filed 1994·Granted Dec 31, 1996·17 cites·18 claims
- 1855US8552819B2High coupling, low loss saw filter and associated methodABBOTT BENJAMIN P·Filed 2011·Granted Oct 8, 2013·1 cites·16 claims
- 1955US7221173B2Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping processAGERE SYSTEMS INC·Filed 2004·Granted May 22, 2007·6 cites·10 claims
- 2053US7973544B2Thermal monitoring and management of integrated circuitsAGERE SYSTEMS INC·Filed 2008·Granted Jul 5, 2011·0 cites·20 claims
- 2151US2008280403A1Transistor fabrication methodCHITTIPEDDI SAILESH·Filed 2008·Application pending·0 cites
- 2249US8030199B2Transistor fabrication methodAGERE SYSTEMS INC·Filed 2010·Granted Oct 4, 2011·0 cites·14 claims
- 2348US2013056868A1Routing under bond pad for the replacement of an interconnect layerAGERE SYSTEMS LLC·Filed 2012·Application pending·0 cites
- 2443US8241986B2Semiconductor device and process for reducing damaging breakdown in gate dielectricsKOOK TAEHO·Filed 2011·Granted Aug 14, 2012·0 cites·8 claims
- 2542US8089130B2Semiconductor device and process for reducing damaging breakdown in gate dielectricsKOOK TAEHO·Filed 2006·Granted Jan 3, 2012·0 cites·10 claims
- 2642US6498080B1Transistor fabrication methodAGERE SYST GUARDIAN CORP·Filed 1996·Granted Dec 24, 2002·9 cites·1 claims
- 2739US5326727AMethod for integrated circuit fabrication including linewidth control during etchingAT & T BELL LAB·Filed 1992·Granted Jul 5, 1994·11 cites·9 claims
- 2838US2002197838A1Transistor fabrication methodFiled 2002·Application pending·0 cites
- 2931US5945355AIntegrated circuit fabricationLUCENT TECHNOLOGIES INC·Filed 1997·Granted Aug 31, 1999·1 cites·6 claims
Join the waitlist — get patent alerts
Get an alert when Taeho Kook files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →