Inventor · disambiguated record
Taichi Koyama
Also filed as: KOYAMA TAICHI
10 granted patents·3 pending applications·17 citations·filing 2010–2023
81Inventor score
Top patents by PatentIndex Score
13 records- 0190US9994743B2Adhesive and light-emitting deviceDEXERIALS CORP·Filed 2014·Granted Jun 12, 2018·13 cites·20 claims
- 0266US9840645B2Underfill material and method for manufacturing semiconductor device using the sameDEXERIALS CORP·Filed 2014·Granted Dec 12, 2017·2 cites·12 claims
- 0364US2025179307A1Nonelectrolytic plating primer composition, laminate, and method for manufacturing sameMITSUI CHEMICALS INC·Filed 2023·Application pending·0 cites
- 0462US11921132B2Anisotropic conductive sheet, electrical inspection device and electrical inspection methodMITSUI CHEMICALS INC·Filed 2020·Granted Mar 5, 2024·0 cites·21 claims
- 0560US12007410B2Sheet connector, sheet set, electrical inspection device, and electrical inspection methodMITSUI CHEMICALS INC·Filed 2020·Granted Jun 11, 2024·0 cites·20 claims
- 0660US9957411B2Underfill material and method for manufacturing semiconductor device using the sameDEXERIALS CORP·Filed 2014·Granted May 1, 2018·1 cites·14 claims
- 0756US8802776B2Epoxy resin composition, method for producing composite unit using the epoxy resin composition, and composite unitKOYAMA TAICHI·Filed 2010·Granted Aug 12, 2014·1 cites·16 claims
- 0854US11860193B2Anisotropic conductive sheet, anisotropic conductive composite sheet, anisotropic conductive sheet set, electric inspection device and electric inspection methodMITSUI CHEMICALS INC·Filed 2019·Granted Jan 2, 2024·0 cites·18 claims
- 0953US9437462B2Underfill material and method for manufacturing semiconductor device by using the sameDEXERIALS CORP·Filed 2014·Granted Sep 6, 2016·0 cites·5 claims
- 1047US2013224913A1Underfill material and method for manufacturing semiconductor device by using the sameDEXERIALS CORP·Filed 2013·Application pending·0 cites
- 1144US9691677B2Underfill material and method for manufacturing semiconductor device using the sameDEXERIALS CORP·Filed 2014·Granted Jun 27, 2017·0 cites·4 claims
- 1243US2022151069A1Anisotropic conductive sheet, electrical inspection apparatus, and electrical inspection methodMITSUI CHEMICALS INC·Filed 2020·Application pending·0 cites
- 1337US9084373B2Thermally conductive adhesiveKOYAMA TAICHI·Filed 2011·Granted Jul 14, 2015·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →