Inventor · disambiguated record
Taison Ku
Also filed as: KU TAISON
1 granted patent·2 pending applications·48 citations·filing 2000–2025
48Inventor score
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3 records- 0177US6409473B1Low stress connection methodology for thermally incompatible materialsHONEYWELL INT INC·Filed 2000·Granted Jun 25, 2002·48 cites·8 claims
- 0263US2025369107A1Container assemblies, chamber arrangements and semiconductor processing systems including container assemblies, and methods of making container assemblies and depositing material layersASM IP HOLDING BV·Filed 2025·Application pending·0 cites
- 0348US2025300000A1Susceptors, semiconductor processings systems, and related methodsASM IP HOLDING BV·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →