Inventor · disambiguated record
Takaki Kuno
Also filed as: KUNO TAKAKI
8 granted patents·5 pending applications·71 citations·filing 1995–2011
85Inventor score
Top patents by PatentIndex Score
13 records- 0175US7901797B2Low-adhesion material, resin molding die, and soil resistant materialTOWA CORP·Filed 2006·Granted Mar 8, 2011·2 cites·15 claims
- 0275US5753538AMethod of sealing electronic parts with molded resin and mold employed thereforTOWA CORP·Filed 1995·Granted May 19, 1998·42 cites·26 claims
- 0374US6436331B1Method of resin sealing a gap between a semiconductor chip and a substrateTOWA CORP·Filed 2000·Granted Aug 20, 2002·13 cites·15 claims
- 0471US7614293B2Method of evaluating adhesion property, low-adhesion material, and mold for molding resinTOWA CORP·Filed 2005·Granted Nov 10, 2009·2 cites·1 claims
- 0570US7732037B2Conductive porous material, resin molding die employing the same, and method of preparing conductive porous materialTOWA CORP·Filed 2005·Granted Jun 8, 2010·2 cites·9 claims
- 0669US7784764B2Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing materialTOWA CORP·Filed 2005·Granted Aug 31, 2010·2 cites·11 claims
- 0763US7287975B2Resin mold material and resin moldJAPAN FINE CERAMICS CT·Filed 2004·Granted Oct 30, 2007·5 cites·15 claims
- 0860US2010012816A1Method of evaluating adhesion property, low-adhesion material, and mold for molding resinKUNO TAKAKI·Filed 2009·Application pending·0 cites
- 0956US7407146B2Composite material and resin moldTOWA CORP·Filed 2004·Granted Aug 5, 2008·3 cites·8 claims
- 1054US2012076886A1Method of evaluating adhesion property, low-adhesion material, and mold for molding resinKUNO TAKAKI·Filed 2011·Application pending·0 cites
- 1152US2011042857A1Method of evaluating adhesion property, low-adhesion material, and mold for molding resinKUNO TAKAKI·Filed 2010·Application pending·0 cites
- 1242US2008296532A1Low Adhesion Material, Resin Molding Die, and Soil Resistant MaterialKUNO TAKAKI·Filed 2006·Application pending·0 cites
- 1340US2006131780A1Resin casting mold and method of casting resinTOWA CORP·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Takaki Kuno files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →