Inventor · disambiguated record
Tae Heon Lee
Also filed as: LEE TAE H · LEE TAE HEON
29 granted patents·7 pending applications·345 citations·filing 1999–2024
96Inventor score
Top patents by PatentIndex Score
36 records- 0196US12059939B2Corner module apparatus for vehicleHYUNDAI MOBIS CO LTD·Filed 2022·Granted Aug 13, 2024·6 cites·14 claims
- 0294US6358567B2Colloidal spray method for low cost thin coating depositionUNIV CALIFORNIA·Filed 1999·Granted Mar 19, 2002·126 cites·27 claims
- 0393US11577783B2Independently driving wheel module and mounting method thereofHYUNDAI MOBIS CO LTD·Filed 2021·Granted Feb 14, 2023·4 cites·15 claims
- 0493US7321162B1Semiconductor package having reduced thicknessAMKOR TECHNOLOGY INC·Filed 2006·Granted Jan 22, 2008·31 cites·20 claims
- 0592US11851103B2Independently driving wheel module and mounting method thereofHYUNDAI MOBIS CO LTD·Filed 2023·Granted Dec 26, 2023·2 cites·15 claims
- 0692US11718139B2System and method for controlling vehicleHYUNDAI MOBIS CO LTD·Filed 2021·Granted Aug 8, 2023·4 cites·20 claims
- 0791US12344066B2Corner module apparatus for vehicleHYUNDAI MOBIS CO LTD·Filed 2022·Granted Jul 1, 2025·2 cites·13 claims
- 0889US6525406B1Semiconductor device having increased moisture path and increased solder joint strengthAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 25, 2003·69 cites·43 claims
- 0986US11644946B2Method and user terminal for displaying icon representing set of content on a chat room screenKAKAO CORP·Filed 2022·Granted May 9, 2023·3 cites·18 claims
- 1086US6696747B1Semiconductor package having reduced thicknessAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 24, 2004·39 cites·20 claims
- 1182US10608340B2Antenna module and electronic device having the sameWITS CO LTD·Filed 2018·Granted Mar 31, 2020·4 cites·23 claims
- 1281US12437144B2Content recommendation method and user terminalKAKAO CORP·Filed 2021·Granted Oct 7, 2025·1 cites·20 claims
- 1380US9862405B2AFS system for vehicleHYUNDAI MOTOR CO LTD·Filed 2015·Granted Jan 9, 2018·3 cites·18 claims
- 1475US6475827B1Method for making a semiconductor package having improved defect testing and increased production yieldAMKOR TECHNOLOGY INC·Filed 2000·Granted Nov 5, 2002·25 cites·20 claims
- 1574US12157342B2System and method for controlling vehicleHYUNDAI MOBIS CO LTD·Filed 2023·Granted Dec 3, 2024·0 cites·18 claims
- 1668US12335212B2Method and server for providing content list and operating method of user terminalKAKAO CORP·Filed 2024·Granted Jun 17, 2025·0 cites·15 claims
- 1767US7102208B1Leadframe and semiconductor package with improved solder joint strengthAMKOR TECHNOLOGY INC·Filed 2000·Granted Sep 5, 2006·15 cites·19 claims
- 1866US9757342B2Method for preparing protein cage, and in situ method for preparing hydrophobic additive-supported core-shell structured polymer-protein particlesPUSAN NAT UNIV INDUSTRY—UNIV COOP FOUND·Filed 2013·Granted Sep 12, 2017·1 cites·8 claims
- 1963US2024375710A1Steering apparatus for vehicle and operating method thereofHYUNDAI MOBIS CO LTD·Filed 2024·Application pending·0 cites
- 2062US12351258B2Corner module apparatusHYUNDAI MOBIS CO LTD·Filed 2023·Granted Jul 8, 2025·0 cites·17 claims
- 2161US2023049121A1Cognitive function test server and methodLOOXID LABS INC·Filed 2022·Application pending·0 cites
- 2258US2023225651A1Cognitive function test server and methodLOOXID LABS INC·Filed 2021·Application pending·0 cites
- 2357US12034681B2Method and server for providing content list and operating method of user terminalKAKAO CORP·Filed 2021·Granted Jul 9, 2024·0 cites·20 claims
- 2457US8856714B2Method and system for designing 3D semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 7, 2014·1 cites·13 claims
- 2556US12273034B2Power converting device, power management integrated circuit, and method for controlling power converting deviceLX SEMICON CO LTD·Filed 2022·Granted Apr 8, 2025·0 cites·15 claims
- 2655US8161382B2Method for providing font service on service page and system for executing the methodJOUNG EUN JU·Filed 2005·Granted Apr 17, 2012·3 cites·15 claims
- 2755US7115445B2Semiconductor package having reduced thicknessAMKOR TECHNOLOGY INC·Filed 2004·Granted Oct 3, 2006·5 cites·20 claims
- 2854US12459556B2Corner module apparatus for vehicleHYUNDAI MOBIS CO LTD·Filed 2022·Granted Nov 4, 2025·0 cites·7 claims
- 2954US6846558B2Colloidal spray method for low cost thin coating depositionUNIV CALIFORNIA·Filed 2002·Granted Jan 25, 2005·1 cites·16 claims
- 3051US2008283979A1Semiconductor Package Having Reduced ThicknessLEE TAE HEON·Filed 2007·Application pending·0 cites
- 3150US2023347974A1Corner module apparatus for vehicleHYUNDAI MOBIS CO LTD·Filed 2022·Application pending·0 cites
- 3247US10896889B2Multilayer clip structure attached to a chipJMJ KOREA CO LTD·Filed 2019·Granted Jan 19, 2021·0 cites·13 claims
- 3347US2023391181A1Corner module apparatus for vehicleHYUNDAI MOBIS CO LTD·Filed 2022·Application pending·0 cites
- 3446US10218061B2Wireless communications antenna and wireless communications device using the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Feb 26, 2019·0 cites·12 claims
- 3546US2023080175A1Method and device for predicting user stateLOOXID LABS INC·Filed 2021·Application pending·0 cites
- 3644US10698455B2Antenna module and electronic device including the sameWITS CO LTD·Filed 2018·Granted Jun 30, 2020·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →