Inventor · disambiguated record
Taekeun Lee
Also filed as: LEE TAEKEUN
17 granted patents·4 pending applications·130 citations·filing 2001–2025
92Inventor score
Top patents by PatentIndex Score
21 records- 0196US11830785B2Package with windowed heat spreaderSTATS CHIPPAC PTE LTD·Filed 2021·Granted Nov 28, 2023·4 cites·21 claims
- 0294US6967126B2Method for manufacturing plastic ball grid array with integral heatsinkCHIPPAC INC·Filed 2003·Granted Nov 22, 2005·80 cites·17 claims
- 0393US11735489B2Semiconductor device and method of forming hybrid TIM layersSTATS CHIPPAC PTE LTD·Filed 2021·Granted Aug 22, 2023·2 cites·25 claims
- 0484US11929334B2Die-beam alignment for laser-assisted bondingSTATS CHIPPAC PTE LTD·Filed 2020·Granted Mar 12, 2024·2 cites·22 claims
- 0578US9125332B2Filp chip interconnection structure with bump on partial pad and method thereofPENDSE RAJENDRA D·Filed 2010·Granted Sep 1, 2015·5 cites·27 claims
- 0677US12125764B2Semiconductor device and method of forming hybrid TIM layersSTATS CHIPPAC PTE LTD·Filed 2023·Granted Oct 22, 2024·0 cites·33 claims
- 0777US7615865B2Standoff height improvement for bumping technology using solder resistSTATS CHIPPAC LTD·Filed 2007·Granted Nov 10, 2009·8 cites·21 claims
- 0877US6614123B2Plastic ball grid array package with integral heatsinkCHIPPAC INC·Filed 2001·Granted Sep 2, 2003·18 cites·21 claims
- 0977US2025391821A1Semiconductor Device and Method of Forming Package with Double-Sided Integrated Passive DeviceSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 1076US8030756B2Plastic ball grid array package with integral heatsinkCHIPPAC INC·Filed 2007·Granted Oct 4, 2011·5 cites·27 claims
- 1173US9837007B2In-cell touch liquid crystal display apparatusLG DISPLAY CO LTD·Filed 2015·Granted Dec 5, 2017·2 cites·23 claims
- 1267US12424595B2Semiconductor device and method of forming package with double-sided integrated passive deviceSTATS CHIPPAC PTE LTD·Filed 2022·Granted Sep 23, 2025·0 cites·25 claims
- 1365US7217598B2Method for manufacturing plastic ball grid array package with integral heatsinkCHIPPAC INC·Filed 2005·Granted May 15, 2007·2 cites·18 claims
- 1458US12027125B2Display deviceLG DISPLAY CO LTD·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
- 1558US2024347373A1Device for holding a package substrate with reduced warpageSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 1657US7875495B2Standoff height improvement for bumping technology using solder resistSTATS CHIPPAC LTD·Filed 2009·Granted Jan 25, 2011·1 cites·21 claims
- 1756US7759137B2Flip chip interconnection structure with bump on partial pad and method thereofSTATS CHIPPAC LTD·Filed 2008·Granted Jul 20, 2010·1 cites·19 claims
- 1856US2024371719A1Semiconductor Device and Method of Controlling Distribution of Liquid Metal TIM Using Lid StructureSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 1949US2025266390A1Laser assisted bonding device and method for bonding a semiconductor die onto a substrateSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 2045US10845639B2Display deviceLG DISPLAY CO LTD·Filed 2018·Granted Nov 24, 2020·0 cites·15 claims
- 2137US10635208B2Display panel having built-in touchscreen and touch display device including the sameLG DISPLAY CO LTD·Filed 2016·Granted Apr 28, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →