Inventor · disambiguated record
Taewoo Lee
Also filed as: LEE TAEWOO
113 granted patents·45 pending applications·369 citations·filing 2006–2025
99Inventor score
Top patents by PatentIndex Score
158 records- 0198US8895440B2Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMVCHOI DAESIK·Filed 2010·Granted Nov 25, 2014·81 cites·23 claims
- 0297US10424696B2Wavelength converting particle, method for manufacturing wavelength converting particle, and light emitting diode containing wavelength converting particlePOSTECH ACAD IND FOUND·Filed 2015·Granted Sep 24, 2019·13 cites·6 claims
- 0396US8502387B2Integrated circuit packaging system with vertical interconnection and method of manufacture thereofCHOI DAESIK·Filed 2010·Granted Aug 6, 2013·48 cites·20 claims
- 0493US10263207B2Perovskite light emitting device containing exciton buffer layer and method for manufacturing samePOSTECH ACAD IND FOUND·Filed 2015·Granted Apr 16, 2019·7 cites·33 claims
- 0592US10819911B2Electronic device for zooming a preview imageLG ELECTRONICS INC·Filed 2018·Granted Oct 27, 2020·14 cites·15 claims
- 0692US7727875B2Grooving bumped wafer pre-underfill systemSTATS CHIPPAC LTD·Filed 2007·Granted Jun 1, 2010·21 cites·21 claims
- 0791US12317293B2User equipments, base stations, and methodsSHARP KK·Filed 2021·Granted May 27, 2025·2 cites·3 claims
- 0891US9153494B2Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMVSTATS CHIPPAC LTD·Filed 2013·Granted Oct 6, 2015·9 cites·42 claims
- 0989US11917615B2Terminal apparatus, base station apparatus, and communication methodSHARP KK·Filed 2020·Granted Feb 27, 2024·2 cites·3 claims
- 1089US10811035B1Heat-assisted magnetic recording head with constant-width gap between near-field transducer and side shieldSEAGATE TECHNOLOGY LLC·Filed 2019·Granted Oct 20, 2020·11 cites·20 claims
- 1189US10351849B2Pharmaceutical composition for treating cancer comprising microrna as active ingredientBIONEER CORP·Filed 2016·Granted Jul 16, 2019·6 cites·20 claims
- 1289US8115293B2Integrated circuit packaging system with interconnect and method of manufacture thereofMOON DONGSOO·Filed 2009·Granted Feb 14, 2012·26 cites·20 claims
- 1389US8030769B2Grooving bumped wafer pre-underfill systemSTATS CHIPPAC LTD·Filed 2010·Granted Oct 4, 2011·9 cites·25 claims
- 1488US10047284B2Perovskite nanocrystal particle light-emitter whose content is changed, method of producing the same, and light emitting element using the samePOSTECH ACAD IND FOUND·Filed 2015·Granted Aug 14, 2018·4 cites·27 claims
- 1587US12048000B2User equipment, base station, method for a user equipment, and method for a base stationSHARP KK·Filed 2019·Granted Jul 23, 2024·4 cites·4 claims
- 1687US11863326B2Base stations and methodsSHARP KK·Filed 2019·Granted Jan 2, 2024·4 cites·6 claims
- 1787US11849479B2Base stations and methodsSHARP KK·Filed 2019·Granted Dec 19, 2023·4 cites·4 claims
- 1887US11840235B1Electric vehicle and control method thereofHYUNDAI MOTOR CO LTD·Filed 2023·Granted Dec 12, 2023·1 cites·19 claims
- 1987US9117812B2Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliabilitySTATS CHIPPAC LTD·Filed 2013·Granted Aug 25, 2015·7 cites·24 claims
- 2087US7863755B2Package-on-package system with via Z-interconnectionsSTATS CHIPPAC LTD·Filed 2008·Granted Jan 4, 2011·13 cites·17 claims
- 2186US11368973B2Terminal apparatus, base station apparatus, and communication method with beam parameters including quasi co-located antenna port indexesSHARP KK·Filed 2018·Granted Jun 21, 2022·4 cites·4 claims
- 2285US8574964B2Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tapeCHO SUNGWON·Filed 2010·Granted Nov 5, 2013·7 cites·25 claims
- 2384US11937229B2User equipments, base stations, and methodsSHARP KK·Filed 2019·Granted Mar 19, 2024·3 cites·8 claims
- 2484US11205757B2Core-shell structured perovskite particle light-emitter, method of preparing the same and light emitting device using the samePOSTECH ACAD IND FOUND·Filed 2015·Granted Dec 21, 2021·2 cites·18 claims
- 2584US8642384B2Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliabilityLEE JAEHYUN·Filed 2012·Granted Feb 4, 2014·6 cites·25 claims
- 2683US11405140B2Terminal apparatus, base station apparatus, and communication methodSHARP KK·Filed 2019·Granted Aug 2, 2022·3 cites·4 claims
- 2783US10714137B1Near-field transducer having a peg surrounded by a metal aperture plateSEAGATE TECHNOLOGY LLC·Filed 2019·Granted Jul 14, 2020·5 cites·20 claims
- 2882US11737090B2Terminal apparatus, base station apparatus, and communication methodSHARP KK·Filed 2020·Granted Aug 22, 2023·1 cites·3 claims
- 2982US11489141B2Flexible display device including protruding adhesive layerLG DISPLAY CO LTD·Filed 2020·Granted Nov 1, 2022·1 cites·20 claims
- 3080US12023990B2Vehicle and method of controlling the sameHYUNDAI MOTOR CO LTD·Filed 2020·Granted Jul 2, 2024·1 cites·18 claims
- 3180US11997694B2Terminal devices, base station devices, and communication methodsSHARP KK·Filed 2020·Granted May 28, 2024·1 cites·3 claims
- 3280US11864198B2Terminal apparatus, base station apparatus, and communication method using multiple downlink control information formats to schedule multiple physical downlink shared channelsSHARP KK·Filed 2020·Granted Jan 2, 2024·1 cites·5 claims
- 3379US11877283B2Terminal device, base station device, and methodSHARP KK·Filed 2019·Granted Jan 16, 2024·2 cites·12 claims
- 3478US11445530B2Terminal apparatus, base station apparatus, and communication methodSHARP KK·Filed 2018·Granted Sep 13, 2022·2 cites·2 claims
- 3578US11309989B2Terminal apparatus and methodSHARP KK·Filed 2018·Granted Apr 19, 2022·2 cites·2 claims
- 3678US11284247B2Terminal apparatus and methodSHARP KK·Filed 2018·Granted Mar 22, 2022·2 cites·6 claims
- 3776US12063104B2Terminal apparatus, base station apparatus and communication methodSHARP KK·Filed 2019·Granted Aug 13, 2024·2 cites·15 claims
- 3876US11387948B2Terminal apparatus, base station apparatus, communication method, and integrated circuitSHARP KK·Filed 2018·Granted Jul 12, 2022·2 cites·12 claims
- 3976US8624370B2Integrated circuit packaging system with an interposer and method of manufacture thereofCHI HEEJO·Filed 2009·Granted Jan 7, 2014·6 cites·20 claims
- 4076US8258008B2Package-on-package system with via z-interconnections and method for manufacturing thereofLEE TAEWOO·Filed 2010·Granted Sep 4, 2012·4 cites·17 claims
- 4175US12037528B2Method of synthesizing synchronized piezoelectric and luminescent material with piezoelectric ligands and light-emitting particlesUIF UNIV INDUSTRY FOUNDATION YONSEI UNIV·Filed 2023·Granted Jul 16, 2024·0 cites·4 claims
- 4275US9608214B2Integrated conductive substrate, and electronic device employing samePOSTECH ACADEMY—INDUSTRY FOUND·Filed 2013·Granted Mar 28, 2017·3 cites·13 claims
- 4375US8017502B2Wafer system with partial cutsSTATS CHIPPAC LTD·Filed 2006·Granted Sep 13, 2011·4 cites·20 claims
- 4474US12185567B2Flexible display device including protruding adhesive layerLG DISPLAY CO LTD·Filed 2022·Granted Dec 31, 2024·0 cites·22 claims
- 4574US11337238B2Terminal apparatus and communication methodSHARP KK·Filed 2018·Granted May 17, 2022·2 cites·5 claims
- 4674US7786551B2Integrated circuit system with wafer trimmingSTATS CHIPPAC LTD·Filed 2006·Granted Aug 31, 2010·4 cites·17 claims
- 4773US11638283B2User equipment, base station device, and communication method for DCI-based resource allocationSHARP KK·Filed 2019·Granted Apr 25, 2023·2 cites·6 claims
- 4871US11445532B2Terminal apparatus, base station apparatus, and communication methodSHARP KK·Filed 2019·Granted Sep 13, 2022·1 cites·4 claims
- 4970US11259319B2Terminal apparatus, base station apparatus, and communication method using modulation and coding scheme tableSHARP KK·Filed 2019·Granted Feb 22, 2022·1 cites·6 claims
- 5070US2024076672A1Double-helix oligonucleotide construct comprising double-stranded mirna and use thereofBIONEER CORP·Filed 2023·Application pending·0 cites
Showing the top 50 of 158 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →