Inventor · disambiguated record
Takeori Maeda
Also filed as: MAEDA TAKEORI
9 granted patents·4 pending applications·4 citations·filing 2016–2024
77Inventor score
Top patents by PatentIndex Score
13 records- 0187US11302675B2Semiconductor device and method for manufacturing the sameKIOXIA CORP·Filed 2020·Granted Apr 12, 2022·2 cites·8 claims
- 0268US11705436B2Semiconductor device and method for manufacturing the sameKIOXIA CORP·Filed 2022·Granted Jul 18, 2023·0 cites·15 claims
- 0367US2023307422A1Semiconductor device and manufacturing method of the sameKIOXIA CORP·Filed 2023·Application pending·0 cites
- 0466US11114322B2Mold and transfer molding apparatusTOSHIBA MEMORY CORP·Filed 2017·Granted Sep 7, 2021·1 cites·7 claims
- 0565US10262879B2Mold deviceTOSHIBA MEMORY CORP·Filed 2017·Granted Apr 16, 2019·1 cites·13 claims
- 0664US12482788B2Semiconductor device and method of manufacturing a semiconductor deviceKIOXIA CORP·Filed 2022·Granted Nov 25, 2025·0 cites·20 claims
- 0760US11605548B2Transfer molding method with sensor and shut-off pinKIOXIA CORP·Filed 2021·Granted Mar 14, 2023·0 cites·7 claims
- 0859US2025246458A1Semiconductor manufacturing apparatusKIOXIA CORP·Filed 2024·Application pending·0 cites
- 0958US2021398946A1Semiconductor device and manufacturing method of the sameKIOXIA CORP·Filed 2021·Application pending·0 cites
- 1057US2024087970A1Semiconductor device and method of manufacturing semiconductor deviceKIOXIA CORP·Filed 2023·Application pending·0 cites
- 1151US11929332B2Semiconductor device and manufacturing method thereofKIOXIA CORP·Filed 2021·Granted Mar 12, 2024·0 cites·20 claims
- 1241US9997484B2Semiconductor device and manufacturing method of the sameTOSHIBA MEMORY CORP·Filed 2016·Granted Jun 12, 2018·0 cites·16 claims
- 1332US10896825B2MoldTOSHIBA MEMORY CORP·Filed 2017·Granted Jan 19, 2021·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →