Inventor · disambiguated record
Takayuki Maekura
Also filed as: MAEKURA TAKAYUKI
4 granted patents·18 pending applications·22 citations·filing 2020–2024
69Inventor score
Top patents by PatentIndex Score
22 records- 0193US11367736B2Through-stack contact via structures for a three-dimensional memory device and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Jun 21, 2022·9 cites·20 claims
- 0293US11355506B2Through-stack contact via structures for a three-dimensional memory device and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Jun 7, 2022·12 cites·13 claims
- 0383US12127406B2Three-dimensional memory device containing self-aligned isolation strips and methods for forming the sameSANDISK TECHNOLOGIES LLC·Filed 2022·Granted Oct 22, 2024·1 cites·5 claims
- 0472US2024179904A1Stairless three-dimensional memory device containing meandering dielectric isolation structure and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2023·Application pending·0 cites
- 0572US2024179905A1Stairless three-dimensional memory device and method of making thereof by forming replacement word lines through memory openingsSANDISK TECHNOLOGIES LLC·Filed 2023·Application pending·0 cites
- 0672US2024414916A1Three-dimensional memory device including inclined word line contact strips and methods of forming the sameWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 0771US2024179909A1Stairless three-dimensional memory device and method of making the same by forming replacement word linesSANDISK TECHNOLOGIES LLC·Filed 2023·Application pending·0 cites
- 0871US2024178129A1Stairless three-dimensional memory device and method of making thereof by forming replacement word lines through memory openingsSANDISK TECHNOLOGIES LLC·Filed 2023·Application pending·0 cites
- 0970US2024414917A1Memory device including word line contact strips and methods of forming the sameWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 1064US2025176179A1Three-dimensional memory device with dummy slit regions and methods of making the sameWESTERN DIGITAL TECH INC·Filed 2024·Application pending·0 cites
- 1160US2025318118A1Three-dimensional memory device including dielectric wall compartments for word line contact via structures and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 1259US2025174550A1Three-dimensional memory device with variable word line via contact density as function of contact depth and methods of forming the sameWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 1359US2025275134A1Stairless three-dimensional memory device with word line contact via structures located over support features and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 1459US2025374542A1Memory device including self-aligned dielectric base below word line contact via structure and method for forming the sameSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 1558US2024179906A1Stairless three-dimensional memory device and method of making thereof by forming replacement word lines through memory openingsSANDISK TECHNOLOGIES LLC·Filed 2023·Application pending·0 cites
- 1656US2024196612A1Three-dimensional memory devices with lateral block isolation structures and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2023·Application pending·0 cites
- 1755US12250814B2Through-stack contact via structures for a three-dimensional memory device and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2022·Granted Mar 11, 2025·0 cites·20 claims
- 1855US2024260268A1Three-dimensional memory device containing inverted staircase and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2023·Application pending·0 cites
- 1955US2024194262A1Three-dimensional memory devices with lateral block isolation structures and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2023·Application pending·0 cites
- 2054US2024178130A1Stairless three-dimensional memory device and method of making the same by forming replacement word linesSANDISK TECHNOLOGIES LLC·Filed 2023·Application pending·0 cites
- 2150US2025273560A1Stairless three-dimensional memory device with word line contact via structures located over support features and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 2249US2025273561A1Stairless three-dimensional memory device with word line contact via structures located over support features and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →