Inventor · disambiguated record
Tatsuru Matsuoka
Also filed as: MATSUOKA TATSURU
21 granted patents·2 pending applications·51 citations·filing 1991–2025
91Inventor score
Top patents by PatentIndex Score
23 records- 0193US10770287B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Sep 8, 2020·6 cites·18 claims
- 0291US11515143B2Method of manufacturing semiconductor device, substrate processing apparatus, recording medium, and method of processing substrateKOKUSAI ELECTRIC CORP·Filed 2020·Granted Nov 29, 2022·2 cites·22 claims
- 0388US11817314B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Nov 14, 2023·1 cites·20 claims
- 0483US12009201B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Jun 11, 2024·0 cites·22 claims
- 0583US9583338B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Feb 28, 2017·5 cites·17 claims
- 0681US12288684B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Apr 29, 2025·0 cites·21 claims
- 0778US11967499B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Apr 23, 2024·0 cites·23 claims
- 0878US2024242961A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0976US11164741B2Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Nov 2, 2021·1 cites·21 claims
- 1075US11664217B2Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted May 30, 2023·0 cites·20 claims
- 1173US5133126AMethod of producing aluminum tube covered with zincFURUKAWA ALUMINIUM·Filed 1991·Granted Jul 28, 1992·33 cites·1 claims
- 1272US11056337B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jul 6, 2021·0 cites·20 claims
- 1372US10626502B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Granted Apr 21, 2020·1 cites·15 claims
- 1469US10096463B2Method of manufacturing semiconductor device, substrate processing apparatus comprising exhaust port and multiple nozzles, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Oct 9, 2018·1 cites·15 claims
- 1568US9741555B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Aug 22, 2017·1 cites·18 claims
- 1654US11094532B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Aug 17, 2021·0 cites·15 claims
- 1753US2025191906A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1850US10790136B2Method of manufacturing semiconductor device, substrate processing system and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Sep 29, 2020·0 cites·14 claims
- 1949US10804100B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Oct 13, 2020·0 cites·14 claims
- 2045US10755921B2Method of manufacturing semiconductor device, substrate processing apparatus and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Aug 25, 2020·0 cites·14 claims
- 2142US10910214B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Granted Feb 2, 2021·0 cites·14 claims
- 2242US10074535B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Sep 11, 2018·0 cites·18 claims
- 2338US9934962B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Apr 3, 2018·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →