Inventor · disambiguated record
Takeo Miura
Also filed as: MIURA TAKEO
15 granted patents·2 pending applications·352 citations·filing 1983–2023
94Inventor score
Top patents by PatentIndex Score
17 records- 0191US4536005AFront leg shield for a motor scooterHONDA MOTOR CO LTD·Filed 1983·Granted Aug 20, 1985·60 cites·9 claims
- 0290US6789224B2Method and apparatus for testing semiconductor devicesADVANTEST CORP·Filed 2001·Granted Sep 7, 2004·55 cites·24 claims
- 0390US5044646AScooter type vehicleHONDA MOTOR CO LTD·Filed 1989·Granted Sep 3, 1991·93 cites·30 claims
- 0479USD290824SMotorcycleHONDA MOTOR CO LTD·Filed 1984·Granted Jul 14, 1987·17 cites·1 claims
- 0570US7409615B2Test apparatus and test methodADVANTEST CORP·Filed 2006·Granted Aug 5, 2008·8 cites·6 claims
- 0670US6158649ASolder ball mounting apparatus and methodNEC CORP·Filed 1999·Granted Dec 12, 2000·39 cites·9 claims
- 0764US6016565ASemiconductor device testing apparatusADVANTEST CORP·Filed 1997·Granted Jan 18, 2000·27 cites·14 claims
- 0857USD305415SMotorcycleHONDA MOTOR CO LTD·Filed 1987·Granted Jan 9, 1990·7 cites·1 claims
- 0957USD299709SMotorcycleHONDA MOTOR CO LTD·Filed 1986·Granted Feb 7, 1989·7 cites·1 claims
- 1056US7283920B2Apparatus and method for testing semiconductor deviceADVANTEST CORP·Filed 2003·Granted Oct 16, 2007·7 cites·54 claims
- 1154US2023343631A1Test method, manufacturing method, panel level package, and test apparatusADVANTEST CORP·Filed 2023·Application pending·0 cites
- 1254US2023343652A1Test method and manufacturing methodADVANTEST CORP·Filed 2023·Application pending·0 cites
- 1345US6401225B1Comparator circuit for semiconductor test systemADVANTEST CORP·Filed 1999·Granted Jun 4, 2002·12 cites·8 claims
- 1439US5898214AWire bonding deviceNEC CORP·Filed 1998·Granted Apr 27, 1999·8 cites·5 claims
- 1538US5818277ATemperature balanced circuitADVANTEST CORP·Filed 1997·Granted Oct 6, 1998·5 cites·7 claims
- 1636US6170647B1Conveyor and reflow device using the sameNEC CORP·Filed 1999·Granted Jan 9, 2001·5 cites·18 claims
- 1731US5908150AMethod for inner lead bondingNEC CORP·Filed 1997·Granted Jun 1, 1999·2 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →