Inventor · disambiguated record
Takahiro Miyakura
Also filed as: MIYAKURA TAKAHIRO
5 granted patents·2 pending applications·7 citations·filing 2017–2024
67Inventor score
Technology areasH10P
Top patents by PatentIndex Score
7 records- 0185US10840094B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Nov 17, 2020·4 cites·19 claims
- 0279US10529560B2Method of manufacturing semiconductor device, substrate processing apparatus and recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Granted Jan 7, 2020·3 cites·20 claims
- 0365US12435439B2Substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Granted Oct 7, 2025·0 cites·20 claims
- 0461US2025105007A1Substrate processing method, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0556US2024105465A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 0647US11581200B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Feb 14, 2023·0 cites·17 claims
- 0744US10262872B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Apr 16, 2019·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →