Inventor · disambiguated record
Takuya Nagamine
Also filed as: NAGAMINE TAKUYA
7 granted patents·3 pending applications·51 citations·filing 2000–2007
83Inventor score
Files withNIPPON MICRO COATING KK3HORIMOTO SANAKI2LSI LOGIC CORP1MIPOX INTERNAT CORP1NIHON MICRO COATING COMPANY LT1
Top patents by PatentIndex Score
10 records- 0174US6413151B2CMP slurry recycling apparatus and method for recycling CMP slurryLSI LOGIC CORP·Filed 2000·Granted Jul 2, 2002·18 cites·17 claims
- 0272US7776793B2System and method for polishing surface of tape-like metallic base materialNIPPON MICRO COATING KK·Filed 2007·Granted Aug 17, 2010·6 cites·18 claims
- 0372US7241204B2Polishing pad, method of producing same and method of polishingNIPPON MICRO COATING KK·Filed 2006·Granted Jul 10, 2007·5 cites·16 claims
- 0461US8148301B2Method for polishing tape-shaped substrate for oxide superconductor, oxide superconductor, and base material for oxide superconductorHORIMOTO SANAKI·Filed 2007·Granted Apr 3, 2012·3 cites·14 claims
- 0559US7238097B2Polishing pad and method of producing sameNIHON MICROCOATING CO LTD·Filed 2004·Granted Jul 3, 2007·9 cites·16 claims
- 0657US7044697B2Cutting tool for simultaneous facing and grooving of CMP padMIPOX INTERNAT CORP·Filed 2004·Granted May 16, 2006·8 cites·19 claims
- 0756US8143194B2Method for polishing tape-shaped substrate for oxide superconductor, oxide superconductor, and base material for oxide superconductorHORIMOTO SANAKI·Filed 2007·Granted Mar 27, 2012·2 cites·9 claims
- 0841US2007264919A1Polishing padNIHON MICRO COATING COMPANY LT·Filed 2007·Application pending·0 cites
- 0940US2005020188A1Polishing pad, method of producing same, and polishing methodFiled 2004·Application pending·0 cites
- 1039US2006229000A1Polishing padNIPPON MICRO COATING KK·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →