Inventor · disambiguated record
Takashi Nakamitsu
Also filed as: NAKAMITSU TAKASHI
6 granted patents·1 pending application·19 citations·filing 2017–2023
77Inventor score
Files withTOKYO ELECTRON LTD7
Top patents by PatentIndex Score
7 records- 0194US10985132B2Bonding apparatus, bonding system, bonding method and storage mediumTOKYO ELECTRON LTD·Filed 2020·Granted Apr 20, 2021·4 cites·14 claims
- 0293US10438920B2Bonding apparatus, bonding system, bonding method and storage mediumTOKYO ELECTRON LTD·Filed 2017·Granted Oct 8, 2019·12 cites·17 claims
- 0379US11094667B2Bonding apparatus, bonding system, bonding method, and recording mediumTOKYO ELECTRON LTD·Filed 2017·Granted Aug 17, 2021·3 cites·9 claims
- 0460US11658146B2Bonding apparatus, bonding system, bonding method, and recording mediumTOKYO ELECTRON LTD·Filed 2021·Granted May 23, 2023·0 cites·11 claims
- 0559US10756046B2Bonding apparatus, bonding system, bonding method and storage mediumTOKYO ELECTRON LTD·Filed 2019·Granted Aug 25, 2020·0 cites·17 claims
- 0653US2024006207A1Bonding apparatus and bonding methodTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0751US11488929B2Bonding apparatus, bonding system, bonding method, and recording mediumTOKYO ELECTRON LTD·Filed 2017·Granted Nov 1, 2022·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →