Inventor · disambiguated record
Takuo Nishida
Also filed as: NISHIDA TAKUO
9 granted patents·11 pending applications·16 citations·filing 1991–2023
81Inventor score
Top patents by PatentIndex Score
20 records- 0174US7718265B2Release sheetLINTEC CORP·Filed 2007·Granted May 18, 2010·2 cites·14 claims
- 0270US9034140B2Adhesive sheetLINTEC CORP·Filed 2013·Granted May 19, 2015·1 cites·21 claims
- 0361US2010021669A1Release sheet and pressure-sensitive adhesive articleLINTEC CORP·Filed 2007·Application pending·0 cites
- 0460US2009117306A1Release sheet and production process for the sameLINTEC CORP·Filed 2007·Application pending·0 cites
- 0559US7897229B2Release sheet and pressure-sensitive adhesive articleLINTEC CORP·Filed 2006·Granted Mar 1, 2011·0 cites·8 claims
- 0658US2011206927A1Adhesive sheetLINTEC CORP·Filed 2009·Application pending·0 cites
- 0756US2009258225A1Double-sided pressure-sensitive adhesive sheet and production method thereofLINTEC CORP·Filed 2009·Application pending·0 cites
- 0854US2011129613A1Release sheet and production process for the sameLINTEC CORP·Filed 2011·Application pending·0 cites
- 0954US2010092772A1Pressure-sensitive adhesive sheetLINTEC CORP·Filed 2008·Application pending·0 cites
- 1052US2007231543A1Release sheetLINTEC CORP·Filed 2007·Application pending·0 cites
- 1149US2013139882A1Transparent protective sheet and solar cell module using the sameNISHIDA TAKUO·Filed 2011·Application pending·0 cites
- 1246US5883264AProcess for preparing optically active trans-3-phenylglycidamide compoundsTANABE SEIYAKU CO·Filed 1997·Granted Mar 16, 1999·4 cites·15 claims
- 1345US2010215881A1Double-faced pressure-sensitive adhesive sheet used for electronic components and producing method thereofLINTEC CORP·Filed 2008·Application pending·0 cites
- 1445US2025206989A1Film-shaped sintering material for heating and pressurization, and method for producing semiconductor deviceLINTEC CORP·Filed 2023·Application pending·0 cites
- 1545US2012088053A1Release Sheet and Pressure-Sensitive Adhesive ArticleMIYATA SOU·Filed 2011·Application pending·0 cites
- 1642US8110271B2Adhesive sheet and release sheetTAKEUCHI OSAMU·Filed 2007·Granted Feb 7, 2012·0 cites·16 claims
- 1741US10636691B2Semiconductor processing sheetLINTEC CORP·Filed 2017·Granted Apr 28, 2020·0 cites·11 claims
- 1838US5926705AMethod for manufacturing a semiconductor device with stabilization of a bipolar transistor and a schottky barrier diodeNEC CORP·Filed 1996·Granted Jul 20, 1999·7 cites·16 claims
- 1938US5204248AProcess for preparing 2-halogeno-3-hydroxy-3-phenyl-propionic acid ester compoundsTANABE SEIYAKU CO·Filed 1991·Granted Apr 20, 1993·2 cites·25 claims
- 2025US9905451B2Sheet for semiconductor-related-member processing and method of manufacturing chips using the sheetLINTEC CORP·Filed 2015·Granted Feb 27, 2018·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →