Inventor · disambiguated record
Takafumi Nishita
Also filed as: NISHITA TAKAFUMI
27 granted patents·6 pending applications·503 citations·filing 1996–2014
97Inventor score
Top patents by PatentIndex Score
33 records- 0196US6291273B1Plastic molded type semiconductor device and fabrication process thereofHITACHI LTD·Filed 1996·Granted Sep 18, 2001·208 cites·18 claims
- 0293US6596561B2Method of manufacturing a semiconductor device using reinforcing patterns for ensuring mechanical strength during manufactureHITACHI LTD·Filed 2001·Granted Jul 22, 2003·65 cites·35 claims
- 0391US7015069B2Method of manufacturing a semiconductor device and a semiconductor deviceHITACHI YONEZAWA ELECTRONICS·Filed 2005·Granted Mar 21, 2006·22 cites·6 claims
- 0490US7396701B2Electronic device and manufacturing method of the sameRENESAS TECH CORP·Filed 2005·Granted Jul 8, 2008·24 cites·7 claims
- 0582US6723583B2Method of manufacturing a semiconductor device using a moldRENESAS TECH CORP·Filed 2003·Granted Apr 20, 2004·25 cites·22 claims
- 0681US6900551B2Semiconductor device with alternate bonding wire arrangementHITACHI ULSI SYS CO LTD·Filed 2003·Granted May 31, 2005·28 cites·13 claims
- 0778US6750080B2Semiconductor device and process for manufacturing the sameRENESAS TECH CORP·Filed 2003·Granted Jun 15, 2004·24 cites·9 claims
- 0875US9455240B2Method of manufacturing semiconductor device and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Sep 27, 2016·4 cites·13 claims
- 0972US6872597B2Method of manufacturing a semiconductor device and a semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Mar 29, 2005·13 cites·15 claims
- 1070US7445969B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted Nov 4, 2008·4 cites·3 claims
- 1168US7449786B2Semiconductor device having improved adhesion between bonding and ball portions of electrical connectorsRENESAS TECH CORP·Filed 2006·Granted Nov 11, 2008·6 cites·8 claims
- 1267US7332800B2Semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Feb 19, 2008·15 cites·13 claims
- 1365US8534532B2Method of manufacturing semiconductor deviceKONNO JUMPEI·Filed 2012·Granted Sep 17, 2013·2 cites·17 claims
- 1465US7247576B2Method of manufacturing a semiconductor deviceHITACHI ULSI SYS CO LTD·Filed 2005·Granted Jul 24, 2007·2 cites·4 claims
- 1565US7049214B2Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectorsRENESAS TECH CORP·Filed 2004·Granted May 23, 2006·8 cites·13 claims
- 1665US6558980B2Plastic molded type semiconductor device and fabrication process thereofFiled 2001·Granted May 6, 2003·11 cites·8 claims
- 1764US8119050B2Method of manufacturing a semiconductor deviceKURATOMI BUNSHI·Filed 2005·Granted Feb 21, 2012·4 cites·8 claims
- 1862US8557633B2Electronic device and manufacturing method of the sameSHIGEMURA KUNIO·Filed 2011·Granted Oct 15, 2013·2 cites·14 claims
- 1958US6989334B2Manufacturing method of a semiconductor deviceHITACHI ULSI SYS CO LTD·Filed 2003·Granted Jan 24, 2006·6 cites·8 claims
- 2057US6943456B2Plastic molded type semiconductor device and fabrication process thereofHITACHI LTD·Filed 2004·Granted Sep 13, 2005·6 cites·7 claims
- 2155US9818678B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Nov 14, 2017·0 cites·19 claims
- 2255US6552437B1Semiconductor device and method of manufacture thereofHITACHI LTD·Filed 1999·Granted Apr 22, 2003·18 cites·28 claims
- 2352US7678706B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted Mar 16, 2010·0 cites·7 claims
- 2452US7288440B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Oct 30, 2007·4 cites·20 claims
- 2547US8701972B2Method of manufacturing semiconductor deviceRENEASAS ELECTRONICS CORP·Filed 2013·Granted Apr 22, 2014·0 cites·20 claims
- 2647US6692989B2Plastic molded type semiconductor device and fabrication process thereofRENESAS TECH CORP·Filed 2003·Granted Feb 17, 2004·2 cites·8 claims
- 2745US2005121805A1Semiconductor device and a method of manufacturing the sameRENESAS TECHNOLOGY CORP HITACH·Filed 2005·Application pending·0 cites
- 2843US2008253100A1Electronic device and manufacturing method of the sameSHIGEMURA KUNIO·Filed 2008·Application pending·0 cites
- 2940US2009160084A1Manufacturing method of semiconductor deviceKURATOMI BUNSHI·Filed 2006·Application pending·0 cites
- 3038US2005106786A1Method of manufacturing a semiconductor deviceFiled 2004·Application pending·0 cites
- 3136US6791182B2Semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Sep 14, 2004·0 cites·40 claims
- 3236US2003052420A1Semiconductor deviceHITACHI LTD·Filed 2002·Application pending·0 cites
- 3335US2015236003A1Method of manufacturing semiconductor deviceKONNO JUMPEI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →