Inventor · disambiguated record
Takafumi Niwa
Also filed as: NIWA TAKAFUMI
10 granted patents·8 pending applications·26 citations·filing 1996–2024
82Inventor score
Files withTOKYO ELECTRON LTD13HONTAKE KOUICHI1MITSUBISHI HEAVY IND LTD1NIWA TAKAFUMI1SHIMOAOKI TAKESHI1
Top patents by PatentIndex Score
18 records- 0192US10672606B2Coating film forming method, coating film forming apparatus, and storage mediumTOKYO ELECTRON LTD·Filed 2018·Granted Jun 2, 2020·5 cites·13 claims
- 0292US10068763B2Coating film forming method, coating film forming apparatus, and storage mediumTOKYO ELECTRON LTD·Filed 2016·Granted Sep 4, 2018·8 cites·6 claims
- 0354US2024248413A1Substrate treatment method and substrate treatment apparatusTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0453US12404587B2Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2021·Granted Sep 2, 2025·0 cites·15 claims
- 0552US2023085449A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 0650US2024200195A1Substrate processing method, substrate processing apparatus, and recording mediumTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 0748US9972512B2Liquid processing method, memory medium and liquid processing apparatusTOKYO ELECTRON LTD·Filed 2017·Granted May 15, 2018·0 cites·20 claims
- 0846US5851620ADisc metal mold and recorded discVICTOR COMPANY OF JAPAN·Filed 1996·Granted Dec 22, 1998·13 cites·6 claims
- 0945US2022290302A1Substrate liquid processing method, substrate liquid processing apparatus, and computer-readable recording mediumTOKYO ELECTRON LTD·Filed 2020·Application pending·0 cites
- 1044US9786488B2Liquid processing method, memory medium and liquid processing apparatusTOKYO ELECTRON LTD·Filed 2015·Granted Oct 10, 2017·0 cites·15 claims
- 1143US2022251709A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2020·Application pending·0 cites
- 1242US10642168B2Auxiliary exposure apparatus and exposure amount distribution acquisition methodTOKYO ELECTRON LTD·Filed 2017·Granted May 5, 2020·0 cites·13 claims
- 1342US2021317581A1Substrate liquid processing apparatus and substrate liquid processing methodTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
- 1438US2009004607A1Substrate Processing MethodSHIMOAOKI TAKESHI·Filed 2005·Application pending·0 cites
- 1536US8367308B2Substrate processing methodTOKYO ELECTRON LTD·Filed 2011·Granted Feb 5, 2013·0 cites·18 claims
- 1635US2012218531A1Developing method and apparatus using organic-solvent containing developerHONTAKE KOUICHI·Filed 2012·Application pending·0 cites
- 1733US11873723B2Steam turbine plant and method for cleaning sameMITSUBISHI HEAVY IND LTD·Filed 2021·Granted Jan 16, 2024·0 cites·15 claims
- 1831US8110325B2Substrate treatment methodNIWA TAKAFUMI·Filed 2011·Granted Feb 7, 2012·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →