Inventor · disambiguated record
Taichi Obara
Also filed as: OBARA TAICHI
10 granted patents·2 pending applications·91 citations·filing 2006–2025
88Inventor score
Technology areasH10W
Top patents by PatentIndex Score
12 records- 0190US7449726B2Power semiconductor apparatusMITSUBISHI ELECTRIC CORP·Filed 2006·Granted Nov 11, 2008·33 cites·9 claims
- 0289US9613888B2Semiconductor device and semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Apr 4, 2017·13 cites·14 claims
- 0388US7892893B2Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Feb 22, 2011·21 cites·8 claims
- 0485US8093692B2Semiconductor device packaging including a power semiconductor elementOBARA TAICHI·Filed 2011·Granted Jan 10, 2012·11 cites·3 claims
- 0581US9521737B2Power moduleMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Dec 13, 2016·7 cites·8 claims
- 0679US9425065B2Semiconductor device and method of manufacture thereofMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Aug 23, 2016·3 cites·11 claims
- 0775US10366964B2Semiconductor device having switching elements to prevent overcurrent damageMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jul 30, 2019·2 cites·15 claims
- 0860US9449910B2Stress relief layout for high power semiconductor packageMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Sep 20, 2016·1 cites·20 claims
- 0945US2013082283A1Semiconductor device and method of manufacture thereofOTSUKI TAKAMI·Filed 2012·Application pending·0 cites
- 1044US9723718B2Electronic component mounting device and semiconductor device including the sameMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Aug 1, 2017·0 cites·12 claims
- 1144US2025357147A1Method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1242US9125308B2Semiconductor device and method of manufacturing thereofOBARA TAICHI·Filed 2013·Granted Sep 1, 2015·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →