Inventor · disambiguated record
Takaaki Ogashiwa
Also filed as: OGASHIWA TAKAAKI
24 granted patents·11 pending applications·12 citations·filing 2011–2023
90Inventor score
Top patents by PatentIndex Score
35 records- 0191US10384322B2Lubricant material for assisting machining process and machining methodMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Aug 20, 2019·3 cites·25 claims
- 0283US9902851B2Resin composition, prepreg, laminate, and printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2013·Granted Feb 27, 2018·4 cites·38 claims
- 0381US10030141B2Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2013·Granted Jul 24, 2018·2 cites·38 claims
- 0478US9232648B2Molybdenum compound powder, prepreg, and laminateMIYAHIRA TETSURO·Filed 2012·Granted Jan 5, 2016·3 cites·21 claims
- 0568US9902825B2Resin composition, prepreg, and laminated sheetMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Feb 27, 2018·0 cites·14 claims
- 0666US2015111044A1Resin composition, prepreg, and laminated sheetMITSUBISHI GAS CHEMICAL CO·Filed 2014·Application pending·0 cites
- 0765US11097357B2Drill bit and hole formation methodMITSUBISHI GAS CHEMICAL CO·Filed 2020·Granted Aug 24, 2021·0 cites·10 claims
- 0862US2025206915A1Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2023·Application pending·0 cites
- 0961US2025254792A1Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2023·Application pending·0 cites
- 1061US2025206919A1Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2023·Application pending·0 cites
- 1160US2025019517A1Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2022·Application pending·0 cites
- 1257US2024254360A1Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2022·Application pending·0 cites
- 1357US2021257207A1Supporting substrate, supporting substrate-attached laminate and method for manufacturing a package substrate for mounting a semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2021·Application pending·0 cites
- 1456US12134696B2Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2022·Granted Nov 5, 2024·0 cites·13 claims
- 1554US10478991B2Entry sheet for drilling and method for drilling processing using sameMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Nov 19, 2019·0 cites·11 claims
- 1652US2019275593A1Drill Bit And Hole Formation MethodMITSUBISHI GAS CHEMICAL CO·Filed 2017·Application pending·0 cites
- 1751US10674609B2Entry sheet for drillingMITSUBISHI GAS CHEMICAL CO·Filed 2015·Granted Jun 2, 2020·0 cites·18 claims
- 1851US2013136930A1Resin composition, prepreg, and laminateKATO YOSHIHIRO·Filed 2011·Application pending·0 cites
- 1950US10212813B2Resin composition, prepreg, and laminated sheetOGASHIWA TAKAAKI·Filed 2011·Granted Feb 19, 2019·0 cites·10 claims
- 2049US11217445B2Supporting substrate, supporting substrate-attached laminate and method for manufacturing a package substrate for mounting a semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2017·Granted Jan 4, 2022·0 cites·9 claims
- 2148US11383307B2Entry sheet for drilling and method for drilling processing using sameMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Jul 12, 2022·0 cites·10 claims
- 2247US9905328B2Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the sameMITSUBISHI GAS CHEMICAL CO·Filed 2014·Granted Feb 27, 2018·0 cites·16 claims
- 2346US11664240B2Method for producing laminate having patterned metal foil, and laminate having patterned metal foilMITSUBISHI GAS CHEMICAL CO·Filed 2018·Granted May 30, 2023·0 cites·11 claims
- 2446US11197379B2Method for producing printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2018·Granted Dec 7, 2021·0 cites·9 claims
- 2546US9480164B2Resin composition, prepreg, and laminateOGASHIWA TAKAAKI·Filed 2012·Granted Oct 25, 2016·0 cites·34 claims
- 2645US12119277B2Method for producing package substrate for mounting semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2019·Granted Oct 15, 2024·0 cites·7 claims
- 2745US10486324B2Entry sheet for drilling and method for drilling processing using sameMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Nov 26, 2019·0 cites·10 claims
- 2845US9955573B2Resin composition, prepreg and laminateKATO YOSHIHIRO·Filed 2012·Granted Apr 24, 2018·0 cites·12 claims
- 2944US11081367B2Support and method for producing semiconductor device-mounting substrate using the sameMITSUBISHI GAS CHEMICAL CO·Filed 2018·Granted Aug 3, 2021·0 cites·16 claims
- 3043US11877396B2Laminate, metal foil-clad laminate, laminate having patterned metal foil, laminate having buildup structure, printed wiring board, multilayer coreless substrate, and method for producing sameMITSUBISHI GAS CHEMICAL CO·Filed 2019·Granted Jan 16, 2024·0 cites·13 claims
- 3142US11990349B2Method for producing package substrate for loading semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2019·Granted May 21, 2024·0 cites·6 claims
- 3237US10727081B2Method for manufacturing package substrate for mounting a semiconductor device, and method for manufacturing semiconductor device mounting substrateMITSUBISHI GAS CHEMICAL CO·Filed 2017·Granted Jul 28, 2020·0 cites·13 claims
- 3337US2013045650A1Resin composition, prepreg, and laminated sheetMITSUBISHI GAS CHEMICAL CO·Filed 2011·Application pending·0 cites
- 3436US2019184472A1Drill Bit And Hole Formation MethodMITSUBISHI GAS CHEMICAL CO·Filed 2017·Application pending·0 cites
- 3535US10964552B2Methods for producing laminate and substrate for mounting a semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2015·Granted Mar 30, 2021·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →