Resin composition, prepreg, and laminated sheet

Abstract

There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler.

What is claimed is: 
     
         1 . A resin composition comprising:
 a non-halogen epoxy resin (A);   a biphenyl aralkyl phenolic resin (B);   a maleimide compound (C);   an inorganic filler (D); and   a naphthol aralkyl resin (E).   
     
     
         2 . The resin composition according to  claim 1 , wherein the non-halogen epoxy resin (A) is selected from the group consisting of phenol phenyl aralkyl epoxy resins, phenol biphenyl aralkyl epoxy resins, and naphthol aralkyl epoxy resins. 
     
     
         3 . The resin composition according to  claim 1 , wherein the biphenyl aralkyl phenol resin (B) is represented by formula (I): 
       
         
           
           
               
               
           
         
         wherein m is an integer of 1 or more. 
       
     
     
         4 . The resin composition according to  claim 1 , wherein the non-halogen epoxy resin (A) is contained in an amount of 20 to 60 parts by weight based on 100 parts by weight in total weight of the non-halogen epoxy resin (A), the biphenyl aralkyl phenolic resin (B) and maleimide compound (C). 
     
     
         5 . The resin composition according to  claim 1 , wherein the biphenyl aralkyl phenol resin (B) is contained in an amount that meets a requirement of an OH/Ep ratio of 0.7 to 1.4 wherein OH represents the number of hydroxyl groups in the biphenyl aralkyl phenol resin; and Ep represents the number of epoxy groups in the non-halogen epoxy resin (A). 
     
     
         6 . The resin composition according to  claim 1 , wherein the maleimide compound (C) is contained in an amount of 5 to 50 parts by weight based on 100 parts by weight in total weight of the non-halogen epoxy resin (A), the biphenyl aralkyl phenolic resin (B) and maleimide compound (C). 
     
     
         7 . The resin composition according to  claim 1 , wherein the inorganic filler (D) is contained in an amount of 50 to 150 parts by weight based on 100 parts by weight in total weight of the non-halogen epoxy resin (A), the biphenyl aralkyl phenolic resin (B) and maleimide compound (C). 
     
     
         8 . The resin composition according to  claim 1 , wherein the content of the naphthol aralkyl resin (E) is not more than 80% by weight based on the total amount of phenolic resins including the biphenyl aralkyl phenol resin (B). 
     
     
         9 . The resin composition according to  claim 1 , which further comprises (F) a silicone powder. 
     
     
         10 . The resin composition according to  claim 1 , wherein the inorganic filler (D) is boehmite. 
     
     
         11 . A prepreg comprising: a base material; and a resin composition according to  claim 1 , impregnated into or coated on the base material. 
     
     
         12 . A laminated sheet comprising a lamination-molded product of a prepreg according to  claim 11 . 
     
     
         13 . A metal foil-clad laminated sheet comprising: a lamination-molded product of a prepreg according to  claim 11  and a metal foil provided on the prepreg.