Inventor · disambiguated record
Tatsuo Ohtani
Also filed as: OHTANI TATSUO
14 granted patents·1 pending application·365 citations·filing 1992–2011
93Inventor score
Top patents by PatentIndex Score
15 records- 0189US6234879B1Method and apparatus for wafer chamfer polishingSHINETSU HANDOTAI KK·Filed 1996·Granted May 22, 2001·76 cites·1 claims
- 0281US5733181AApparatus for polishing the notch of a waferSHINETSU HANDOTAI KK·Filed 1994·Granted Mar 31, 1998·38 cites·11 claims
- 0380US5727990AMethod for mirror-polishing chamfered portion of wafer and mirror-polishing apparatusSHINETSU HANDOTAI KK·Filed 1997·Granted Mar 17, 1998·49 cites·8 claims
- 0480US5476413AApparatus for polishing the periphery portion of a waferSHINETSU HANDOTAI KK·Filed 1994·Granted Dec 19, 1995·52 cites·6 claims
- 0573US5547415AMethod and apparatus for wafer chamfer polishingSHINETSU HANDOTAI KK·Filed 1993·Granted Aug 20, 1996·25 cites·17 claims
- 0669US5404678AWafer chamfer polishing apparatus with rotary circular dividing tableFiled 1993·Granted Apr 11, 1995·26 cites·8 claims
- 0760US5317836AApparatus for polishing chamfers of a waferSHINETSU HANDOTAI KK·Filed 1992·Granted Jun 7, 1994·31 cites·14 claims
- 0859US5316620AMethod and an apparatus for polishing wafer chamfersSHINETSU HANDOTAI KK·Filed 1993·Granted May 31, 1994·29 cites·14 claims
- 0958US5458529AApparatus for polishing notch portion of waferSHINETSU HANDOTAI KK·Filed 1994·Granted Oct 17, 1995·15 cites·16 claims
- 1056US5538463AApparatus for bevelling wafer-edgeSHINETSU HANDOTAI KK·Filed 1993·Granted Jul 23, 1996·14 cites·17 claims
- 1148US9622961B2Water-soluble polyalkylene oxide-modified productOZAWA HITOSHI·Filed 2011·Granted Apr 18, 2017·0 cites·7 claims
- 1243US9574154B2Sheet whose lubricity is maintained under wet conditionsOZAWA HITOSHI·Filed 2011·Granted Feb 21, 2017·0 cites·3 claims
- 1343US2013040868A1Resin composition whose lubricity under wet conditions is maintainedSUMITOMO SEIKA CHEMICALS·Filed 2011·Application pending·0 cites
- 1437US10000629B2Resin composition whose lubricity under wet conditions is maintainedOZAWA HITOSHI·Filed 2010·Granted Jun 19, 2018·0 cites·5 claims
- 1537US5429544APolishing apparatus for notch portion of waferSHIN ETSU HANDOTAL CO LTD·Filed 1994·Granted Jul 4, 1995·10 cites·17 claims
Join the waitlist — get patent alerts
Get an alert when Tatsuo Ohtani files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →