Inventor · disambiguated record
Takao Ono
Also filed as: ONO TAKAO
20 granted patents·13 pending applications·370 citations·filing 1983–2023
95Inventor score
Top patents by PatentIndex Score
33 records- 0192US8347057B2Memory moduleELPIDA MEMORY INC·Filed 2010·Granted Jan 1, 2013·17 cites·15 claims
- 0289US7633147B2Semiconductor unit having two device terminals for every one input/output signalELPIDA MEMORY INC·Filed 2003·Granted Dec 15, 2009·60 cites·10 claims
- 0377US5255001AAntenna system for portable radio apparatusNEC CORP·Filed 1990·Granted Oct 19, 1993·50 cites·19 claims
- 0474US6833618B2Memory system with a socket having socket pins for mounting memory modulesRENESAS TECH CORP·Filed 2001·Granted Dec 21, 2004·28 cites·25 claims
- 0570US5148181AMobile radio communication apparatusNEC CORP·Filed 1990·Granted Sep 15, 1992·39 cites·6 claims
- 0665US5909194ATelescoping, dual antenna mounted with flexible bootNEC CORP·Filed 1997·Granted Jun 1, 1999·36 cites·2 claims
- 0763US5467096AAntenna for a radio communication apparatusNEC CORP·Filed 1994·Granted Nov 14, 1995·31 cites·6 claims
- 0862US5493311ATwo-frequency impedance matching circuit for an antennaNEC CORP·Filed 1994·Granted Feb 20, 1996·32 cites·3 claims
- 0959US2024003844A1Biosensor, detection method, and detection deviceSUZUKI YASUO·Filed 2023·Application pending·0 cites
- 1058US6790293B2Solder work material for forming solder-coated circuit board and circuit boardNEC CORP·Filed 2002·Granted Sep 14, 2004·8 cites·20 claims
- 1157US5438339AAntenna for a radio communication apparatusNEC CORP·Filed 1994·Granted Aug 1, 1995·24 cites·10 claims
- 1252US6036214ABicycle with antitheft deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Mar 14, 2000·23 cites·9 claims
- 1350US12072313B2Graphene transistor and method of manufacturing sameMURATA MANUFACTURING CO·Filed 2021·Granted Aug 27, 2024·0 cites·16 claims
- 1447US7763971B2Circuit module and electrical componentELPIDA MEMORY INC·Filed 2008·Granted Jul 27, 2010·0 cites·13 claims
- 1546US2010061072A1Multi-layer printed circuit boardNEC CORP·Filed 2007·Application pending·0 cites
- 1645US12196654B2Microscopic body detection method and microscopic body detection deviceJAPAN SCIENCE & TECH AGENCY·Filed 2018·Granted Jan 14, 2025·0 cites·28 claims
- 1745US6990363B2Wireless communication device with an improved antenna structureNEC CORP·Filed 2001·Granted Jan 24, 2006·4 cites·30 claims
- 1844US6712262B2Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit boardTAMURAKAKEN CORP·Filed 2002·Granted Mar 30, 2004·5 cites·14 claims
- 1942US6756166B2Photosensitive resin composition and printed wiring boardTAMURAKAKEN CORP·Filed 2002·Granted Jun 29, 2004·1 cites·22 claims
- 2042US4583221ASynchronization system for key telephone systemIWATSU ELECTRIC CO LTD·Filed 1983·Granted Apr 15, 1986·10 cites·2 claims
- 2142US2007090534A1Semiconductor module including a plurality of IC chips thereinIWASAKI HIRONORI·Filed 2006·Application pending·0 cites
- 2240US2005001502A1DC brushless motorFiled 2004·Application pending·0 cites
- 2340US2011317356A1Memory system, memory module, and module socketONO TAKAO·Filed 2011·Application pending·0 cites
- 2439US6726780B2Lead-free solder, and paste solder compositionTAMURA KAKEN CORP·Filed 2003·Granted Apr 27, 2004·2 cites·4 claims
- 2538US2004211291A1Method of manufacturing fine metal particles, substance containing fine metal particles, and paste solder compositionTAMURA KAKEN CORP·Filed 2004·Application pending·0 cites
- 2637US2005248010A1Semiconductor package and system moduleSEMICONDUCTOR INC RENESAS TECH·Filed 2005·Application pending·0 cites
- 2734US6975026B2Package for mounting semiconductor deviceHITACHI LTD·Filed 2003·Granted Dec 13, 2005·0 cites·11 claims
- 2834US2003177865A1Process of producing metal powdersFiled 2003·Application pending·0 cites
- 2933US2003047034A1Method of manufacturing fine metal particles, substance containing fine metal particles, and paste solder compositionTAMURA KAKEN CORP·Filed 2002·Application pending·0 cites
- 3033US2010238695A1Memory module including memory chipsELPIDA MEMORY INC·Filed 2010·Application pending·0 cites
- 3132US2003064305A1Photosensitive resin composition and printed wiring boardFiled 2002·Application pending·0 cites
- 3232US2003064304A1Photosensitive resin composition and printed wiring boardFiled 2002·Application pending·0 cites
- 3324US2004001961A1Curable resin composition useful for coating, multi-layer printed wiring board, printed wiring board and dry filmFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →