Inventor · disambiguated record
Tamarak Pandhumsoporn
Also filed as: PANDHUMSOPORN TAMARAK
8 granted patents·3 pending applications·98 citations·filing 1999–2020
84Inventor score
Top patents by PatentIndex Score
11 records- 0186US7459100B2Methods and apparatus for sequentially alternating among plasma processes in order to optimize a substrateLAM RES CORP·Filed 2004·Granted Dec 2, 2008·40 cites·24 claims
- 0286US6287437B1Recessed bonding of target for RF diode sputteringCIT ALCATEL·Filed 2000·Granted Sep 11, 2001·37 cites·9 claims
- 0368US7351664B2Methods for minimizing mask undercuts and notches for plasma processing systemLAM RES CORP·Filed 2006·Granted Apr 1, 2008·3 cites·30 claims
- 0463US12087557B2Substrate processing system including coil with RF powered faraday shieldLAM RES CORP·Filed 2020·Granted Sep 10, 2024·0 cites·7 claims
- 0553US8262920B2Minimization of mask undercut on deep silicon etchPANDHUMSOPORN TAMARAK·Filed 2007·Granted Sep 11, 2012·1 cites·15 claims
- 0651US6383938B2Method of anisotropic etching of substratesCIT ALCATEL·Filed 1999·Granted May 7, 2002·17 cites·13 claims
- 0742US7985688B2Notch stop pulsing process for plasma processing systemLAM RES CORP·Filed 2005·Granted Jul 26, 2011·0 cites·31 claims
- 0840US2012298301A1Minimization of mask undercut on deep etchPANDHUMSOPORN TAMARAK·Filed 2012·Application pending·0 cites
- 0938US2021225616A1Components and Processes for Managing Plasma Process Byproduct MaterialsLAM RES CORP·Filed 2019·Application pending·0 cites
- 1036US10854492B2Edge ring assembly for improving feature profile tilting at extreme edge of waferLAM RES CORP·Filed 2016·Granted Dec 1, 2020·0 cites·18 claims
- 1136US2005211668A1Methods of processing a substrate with minimal scallopingLAM RES CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →