Inventor · disambiguated record
Taiji Sakai
Also filed as: SAKAI TAIJI
32 granted patents·14 pending applications·162 citations·filing 2002–2022
96Inventor score
Top patents by PatentIndex Score
46 records- 0194US10655922B2Laminated heat sinkT RAD CO LTD·Filed 2016·Granted May 19, 2020·9 cites·8 claims
- 0293US7863524B2Interposer and method for manufacturing the sameFUJITSU LTD·Filed 2007·Granted Jan 4, 2011·24 cites·12 claims
- 0392US7355290B2Interposer and method for fabricating the sameFUJITSU LTD·Filed 2006·Granted Apr 8, 2008·20 cites·9 claims
- 0490US10976110B2Plate laminate type heat exchangerT RAD CO LTD·Filed 2017·Granted Apr 13, 2021·4 cites·9 claims
- 0589US11105559B2Drawn cup-type heat exchangerT RAD CO LTD·Filed 2018·Granted Aug 31, 2021·3 cites·1 claims
- 0688US10006723B2Seal structure for tankT RAD CO LTD·Filed 2015·Granted Jun 26, 2018·4 cites·7 claims
- 0786US11740027B2Stacked plate heat exchangerT RAD CO LTD·Filed 2020·Granted Aug 29, 2023·2 cites·3 claims
- 0885US9402313B2Conductive material, conductive paste, circuit board, and semiconductor deviceFUJITSU LTD·Filed 2014·Granted Jul 26, 2016·5 cites·6 claims
- 0983US7614142B2Method for fabricating an interposerFUJITSU LTD·Filed 2008·Granted Nov 10, 2009·11 cites·12 claims
- 1082US10837718B2Laminated core type heat sinkT RAD CO LTD·Filed 2016·Granted Nov 17, 2020·4 cites·9 claims
- 1181US6964279B2Pressure-type flow rate control apparatusTOKYO ELECTRON LTD·Filed 2002·Granted Nov 15, 2005·27 cites·6 claims
- 1280US11057996B2Circuit board, method of manufacturing circuit board, and electronic deviceFUJITSU LTD·Filed 2019·Granted Jul 6, 2021·3 cites·11 claims
- 1380US10739085B2Laminated heat sink coreTRAD CO LTD·Filed 2017·Granted Aug 11, 2020·5 cites·3 claims
- 1480US10724807B2Heat exchanger and method for assembling sameT RAD CO LTD·Filed 2016·Granted Jul 28, 2020·2 cites·6 claims
- 1579US8922027B2Electronic device having electrodes bonded with each otherFUJITSU LTD·Filed 2012·Granted Dec 30, 2014·4 cites·1 claims
- 1679US8673050B2Conductive material, conductive paste, circuit board, and semiconductor deviceSAKUYAMA SEIKI·Filed 2010·Granted Mar 18, 2014·4 cites·6 claims
- 1779US8479386B2Method for manufacturing interposerSHIOGA TAKESHI·Filed 2010·Granted Jul 9, 2013·5 cites·4 claims
- 1878US8713792B2Method of manufacturing a printed wiring boardSAKAI TAIJI·Filed 2010·Granted May 6, 2014·5 cites·4 claims
- 1975US10309729B2Heat exchanger coreT RAD CO LTD·Filed 2015·Granted Jun 4, 2019·2 cites·1 claims
- 2073US10283434B2Electronic device, method for manufacturing the electronic device, and electronic apparatusFUJITSU LTD·Filed 2016·Granted May 7, 2019·2 cites·9 claims
- 2168US7402461B2Method of connecting base materialsFUJITSU LTD·Filed 2004·Granted Jul 22, 2008·14 cites·12 claims
- 2265US7852439B2Multi-layer display element and manufacturing method for the sameFUJITSU LTD·Filed 2009·Granted Dec 14, 2010·2 cites·20 claims
- 2358US8962470B2Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatusMIZUKOSHI MASATAKA·Filed 2009·Granted Feb 24, 2015·1 cites·5 claims
- 2455US9911642B2Method of manufacturing an electronic device, and electronic device manufacturing apparatusFUJITSU LTD·Filed 2014·Granted Mar 6, 2018·0 cites·8 claims
- 2552US2014202739A1Printed wiring board having metal layers producing eutectic reactionFUJITSU LTD·Filed 2014·Application pending·0 cites
- 2651US11152291B2Multilayer substrateFUJITSU LTD·Filed 2019·Granted Oct 19, 2021·0 cites·5 claims
- 2748US2015132865A1Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatusFUJITSU LTD·Filed 2015·Application pending·0 cites
- 2847US12259201B2Header plates structure of heat exchangerT RAD CO LTD·Filed 2021·Granted Mar 25, 2025·0 cites·2 claims
- 2947US11852866B2Waveguide member and waveguide layered productFUJITSU INTERCONNECT TECH LIMITED·Filed 2020·Granted Dec 26, 2023·0 cites·3 claims
- 3047US10383229B2Electronic apparatus, fabrication method therefor and electronic partFUJITSU LTD·Filed 2018·Granted Aug 13, 2019·0 cites·20 claims
- 3147US9995539B2Corrugated fins for heat exchangerT RAD CO LTD·Filed 2015·Granted Jun 12, 2018·0 cites·3 claims
- 3247US2005161814A1Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatusFUJITSU LTD·Filed 2005·Application pending·0 cites
- 3346US11114418B2Electronic device, method of manufacturing electronic device, and electronic apparatusFUJITSU LTD·Filed 2019·Granted Sep 7, 2021·0 cites·6 claims
- 3446US2022333873A1Brazing structure for flat tube and header plate of heat exchangerT RAD CO LTD·Filed 2020·Application pending·0 cites
- 3546US2025194009A1Multilayer substrate, method for manufacturing multilayer substrate, and electronic deviceFICT LTD·Filed 2022·Application pending·0 cites
- 3645US2020154566A1Wiring substrate and electronic deviceFUJITSU LTD·Filed 2019·Application pending·0 cites
- 3744US2024147613A1Multilayer board and method for manufacturing multilayer boardFICT LTD·Filed 2022·Application pending·0 cites
- 3843US10274262B2Heat exchangerT RAD CO LTD·Filed 2015·Granted Apr 30, 2019·0 cites·7 claims
- 3943US2019024986A1Stacked plate heat exchangerT RAD CO LTD·Filed 2017·Application pending·0 cites
- 4043US2019254164A1Circuit board, method of manufacturing circuit board, and electronic deviceFUJITSU LTD·Filed 2019·Application pending·0 cites
- 4143US2024064907A1Circuit board, method for manufacturing circuit board, and electronic deviceFICT LTD·Filed 2022·Application pending·0 cites
- 4243US2020203266A1Substrate, method of manufacturing substrate, and electronic deviceFUJITSU LTD·Filed 2019·Application pending·0 cites
- 4342US2019192036A1Electronic device and method of manufacturing electronic deviceFUJITSU LTD·Filed 2019·Application pending·0 cites
- 4441US8409931B2Method of manufacturing semiconductor deviceSAKAI TAIJI·Filed 2012·Granted Apr 2, 2013·0 cites·13 claims
- 4540US2023180398A1Circuit board, method for manufacturing circuit board, and electronic deviceFICT LTD·Filed 2021·Application pending·0 cites
- 4636US2012217626A1Semiconductor device and method for manufacturing semiconductor deviceSAKAI TAIJI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →