Inventor · disambiguated record
Taketo Sekine
Also filed as: SEKINE TAKETO
6 granted patents·5 pending applications·13 citations·filing 2014–2024
74Inventor score
Files withAPPLIED MATERIALS INC11
Top patents by PatentIndex Score
11 records- 0193US9362186B2Polishing with eddy current feed meaurement prior to deposition of conductive layerAPPLIED MATERIALS INC·Filed 2015·Granted Jun 7, 2016·10 cites·8 claims
- 0283US11728185B2Steam-assisted single substrate cleaning process and apparatusAPPLIED MATERIALS INC·Filed 2021·Granted Aug 15, 2023·1 cites·20 claims
- 0377US12106976B2Steam-assisted single substrate cleaning process and apparatusAPPLIED MATERIALS INC·Filed 2023·Granted Oct 1, 2024·0 cites·19 claims
- 0475US2025108476A1Temperature control of chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0570US9811077B2Polishing with pre deposition spectrumAPPLIED MATERIALS INC·Filed 2014·Granted Nov 7, 2017·2 cites·19 claims
- 0670US2024253183A1Apparatus and method for controlling substrate polish edge uniformityAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0770US2025114910A1High speed injection nozzle for pre-polish modification of substrate thicknessAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0868US2025114903A1Retaining-ring-less cmp processAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0965US2025114909A1Cold liquid polishing controlAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1054US12214468B2Temperature control of chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2018·Granted Feb 4, 2025·0 cites·11 claims
- 1149US10651098B2Polishing with measurement prior to deposition of outer layerAPPLIED MATERIALS INC·Filed 2016·Granted May 12, 2020·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →