Inventor · disambiguated record
Tae-Wook Seo
Also filed as: SEO TAE W · SEO TAE-WOOK
13 granted patents·7 pending applications·224 citations·filing 1992–2014
92Inventor score
Files withSAMSUNG ELECTRONICS CO LTD7IPS LTD3INTEGRATED PROCESS SYSTEMS LTD2PARK YOUNG H2LEE KI-HOON1
Top patents by PatentIndex Score
20 records- 0181US7842606B2Method of depositing thin film and method of manufacturing semiconductor using the sameINTEGRATED PROCESS SYSTEMS LTD·Filed 2005·Granted Nov 30, 2010·10 cites·11 claims
- 0279US8029859B2Method of depositing Ge-Sb-Te thin filmINTEGRATED PROCESS SYSTEMS LTD·Filed 2006·Granted Oct 4, 2011·4 cites·16 claims
- 0378US6329276B1Method of forming self-aligned silicide in semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Dec 11, 2001·44 cites·13 claims
- 0478US6291342B2Methods of forming titanium nitride composite layers using composite gases having increasing TiCl4 to NH3 ratiosSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Sep 18, 2001·19 cites·2 claims
- 0575US6376303B1Method of manufacturing a capacitor having oxide layers with different impurities and method of fabricating a semiconductor device comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Apr 23, 2002·26 cites·12 claims
- 0675US5326709AWafer testing process of a semiconductor device comprising a redundancy circuitSAMSUNG ELECTRONICS CO LTD·Filed 1992·Granted Jul 5, 1994·77 cites·9 claims
- 0770US7638437B2In-situ thin-film deposition methodIPS LTD·Filed 2005·Granted Dec 29, 2009·3 cites·9 claims
- 0869US7253101B2Deposition method of TiN thin film having a multi-layer structureIPS LTD·Filed 2005·Granted Aug 7, 2007·3 cites·37 claims
- 0965US6207557B1Method of forming multilayer titanium nitride film by multiple step chemical vapor deposition process and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO INC·Filed 1999·Granted Mar 27, 2001·27 cites·16 claims
- 1060US7785664B2Method of depositing thin filmIPS LTD·Filed 2005·Granted Aug 31, 2010·1 cites·23 claims
- 1148US6569782B2Insulating layer, semiconductor device and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted May 27, 2003·2 cites·13 claims
- 1246US2006210712A1Method of depositing thin film on substrate using impulse ALD processPARK YOUNG H·Filed 2006·Application pending·0 cites
- 1345US2006096534A1Apparatus for depositing thin film on waferLIM HONG J·Filed 2005·Application pending·0 cites
- 1444US6387776B1Method for forming trench isolation regionsSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted May 14, 2002·2 cites·17 claims
- 1542US2007144557A1Cleaning method of apparatus for depositing AI-containing metal film and AI-containing metal nitride filmLEE KI-HOON·Filed 2006·Application pending·0 cites
- 1639US2003199146A1Insulating layer, semiconductor device and methods for fabricating the sameFiled 2003·Application pending·0 cites
- 1737US2005003088A1Method of depositing thin film on waferFiled 2004·Application pending·0 cites
- 1836US6372555B1Semiconductor integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Apr 16, 2002·6 cites·10 claims
- 1936US2014373782A1Substrate support apparatus and substrate process apparatus having the sameWONIK IPS CO LTD·Filed 2014·Application pending·0 cites
- 2033US2007026144A1Method of depositing thin film on waferPARK YOUNG H·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →