Inventor · disambiguated record
Takehiko Tanaka
Also filed as: TANAKA TAKEHIKO
144 granted patents·24 pending applications·548 citations·filing 1976–2025
99Inventor score
Top patents by PatentIndex Score
168 records- 0198US10136041B2Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Nov 20, 2018·10 cites·13 claims
- 0297US10171716B2Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Jan 1, 2019·12 cites·7 claims
- 0397US9900487B2Camera module and array camera module based on integral packaging technologyNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Feb 20, 2018·16 cites·30 claims
- 0497US9876948B2Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Jan 23, 2018·14 cites·10 claims
- 0597US9826132B2Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Nov 21, 2017·14 cites·24 claims
- 0696US11363184B2Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2021·Granted Jun 14, 2022·2 cites·16 claims
- 0796US10051167B2Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Aug 14, 2018·9 cites·16 claims
- 0895US10230879B2Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Mar 12, 2019·8 cites·8 claims
- 0995US9876949B2Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Jan 23, 2018·8 cites·24 claims
- 1094US10986258B2Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2019·Granted Apr 20, 2021·2 cites·20 claims
- 1194US10666847B2Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2018·Granted May 26, 2020·4 cites·20 claims
- 1294US10498942B2Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Dec 3, 2019·6 cites·26 claims
- 1394US10367983B2Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2018·Granted Jul 30, 2019·5 cites·16 claims
- 1494US10129452B2Camera module and array camera module based on integral packaging technologyNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Nov 13, 2018·7 cites·30 claims
- 1594US10084949B2Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Sep 25, 2018·6 cites·4 claims
- 1694US9906700B2Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Feb 27, 2018·6 cites·30 claims
- 1794US9781323B1Camera module and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2016·Granted Oct 3, 2017·10 cites·8 claims
- 1893US10477088B2Camera module and array camera module based on integral packaging technologyNINGBO SUNNY OPOTECH CO LTD·Filed 2016·Granted Nov 12, 2019·6 cites·1 claims
- 1993US9998644B1Camera module and molded circuit board assembly and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Jun 12, 2018·7 cites·30 claims
- 2093US9894772B2Manufacturing method of molded photosensitive assembly for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Feb 13, 2018·11 cites·30 claims
- 2193US9781325B1Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Oct 3, 2017·5 cites·20 claims
- 2292US11601576B2Array camera module having height difference, circuit board assembly and manufacturing method therefor, and electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2021·Granted Mar 7, 2023·2 cites·18 claims
- 2392US10129451B2Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Nov 13, 2018·4 cites·13 claims
- 2492US10110791B2Camera module and array camera module based on integral packaging technologyNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Oct 23, 2018·5 cites·27 claims
- 2591US12397485B2Camera module and photosensitive assembly thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2022·Granted Aug 26, 2025·1 cites·19 claims
- 2691US11729483B2Photosensitive component, and camera module and manufacturing method thereforNINGBO SUNNY OPOTECH CO LTD·Filed 2022·Granted Aug 15, 2023·1 cites·12 claims
- 2791US11303789B2Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2020·Granted Apr 12, 2022·2 cites·20 claims
- 2891US10742859B2Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Aug 11, 2020·4 cites·8 claims
- 2991US10735637B2Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2019·Granted Aug 4, 2020·3 cites·6 claims
- 3090US10708480B2Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2018·Granted Jul 7, 2020·1 cites·19 claims
- 3189US9992397B2Camera module and molded circuit board assembly and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Jun 5, 2018·4 cites·30 claims
- 3289US9848109B2Camera module and array camera module based on integral packaging technologyNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Dec 19, 2017·5 cites·30 claims
- 3389US2025370211A1Optical lens, camera module and assembly method thereforNINGBO SUNNY OPOTECH CO LTD·Filed 2025·Application pending·0 cites
- 3488US10578837B2Molded photosensitive assembly for array imaging module for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Mar 3, 2020·1 cites·8 claims
- 3588US10197890B2Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2016·Granted Feb 5, 2019·4 cites·14 claims
- 3688US9781324B2Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Oct 3, 2017·6 cites·24 claims
- 3787US11706516B2Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2020·Granted Jul 18, 2023·1 cites·12 claims
- 3887US2023300442A1Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2023·Application pending·0 cites
- 3985US10440247B2Camera module and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Oct 8, 2019·3 cites·23 claims
- 4085US10321028B2Photosensitive assembly and camera module and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Jun 11, 2019·3 cites·31 claims
- 4184US11575816B2Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2022·Granted Feb 7, 2023·0 cites·20 claims
- 4284US11350020B2Camera module array and assembly method thereforNINGBO SUNNY OPOTECH CO LTD·Filed 2019·Granted May 31, 2022·3 cites·18 claims
- 4384US10194064B2Array camera module based on integral packaging technologyNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Jan 29, 2019·3 cites·30 claims
- 4483US11881491B2Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2023·Granted Jan 23, 2024·0 cites·20 claims
- 4582US12510723B2Optical lens, camera module and assembly method thereforNINGBO SUNNY OPOTECH CO LTD·Filed 2024·Granted Dec 30, 2025·0 cites·14 claims
- 4682US12119361B2Circuit board assembly with photosensitive element mounted to back side of circuit boardNINGBO SUNNY OPOTECH CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
- 4782US12035029B2Camera module and array camera module based on integral packaging technologyNINGBO SUNNY OPOTECH CO LTD·Filed 2022·Granted Jul 9, 2024·0 cites·19 claims
- 4882US11743569B2Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2022·Granted Aug 29, 2023·0 cites·11 claims
- 4982US9407051B2Method of manufacturing waterproof intermediate spliced portion of wires and waterproof intermediate unit of wiresKATOU TAKASHI·Filed 2011·Granted Aug 2, 2016·8 cites·4 claims
- 5082US6819942B2Mobile communication terminalTOSHIBA KK·Filed 2002·Granted Nov 16, 2004·35 cites·13 claims
Showing the top 50 of 168 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →