Inventor · disambiguated record
Takashi Tange
Also filed as: TANGE TAKASHI
6 granted patents·3 pending applications·18 citations·filing 2006–2019
75Inventor score
Top patents by PatentIndex Score
9 records- 0186US7754504B2Light-emitting diode, method for making light-emitting diode, integrated light-emitting diode and method for making integrated light-emitting diode, method for growing a nitride-based III-V group compound semiconductor, light source cell unit, light-emitting diodeSONY CORP·Filed 2006·Granted Jul 13, 2010·14 cites·13 claims
- 0281US10170667B2Semiconductor optical deviceSONY CORP·Filed 2018·Granted Jan 1, 2019·2 cites·10 claims
- 0378US9917228B2Semiconductor optical deviceSONY CORP·Filed 2015·Granted Mar 13, 2018·2 cites·10 claims
- 0461US10546975B2Semiconductor optical deviceSONY CORP·Filed 2018·Granted Jan 28, 2020·0 cites·13 claims
- 0552US12126142B2Nitride semiconductor laser device and method of manufacturing nitride semiconductor laser deviceSONY GROUP CORP·Filed 2019·Granted Oct 22, 2024·0 cites·19 claims
- 0644US2010308349A1Light-emitting diode, method for making light-emitting diode, integrated light-emitting diode and method for making integrated light-emitting diode, method for growing a nitride-based iii-v group compound semiconductor, light source cell unit, light-emitting diode backlight, and light-emitting diode display and electronic deviceSONY CORP·Filed 2010·Application pending·0 cites
- 0736US2014345681A1Multi-junction solar cell, compound semiconductor device, photoelectric conversion device, and compound-semiconductor-layer lamination structureSONY CORP·Filed 2012·Application pending·0 cites
- 0836US2013022070A1Semiconductor laser device and manufacturing method thereofSONY CORP·Filed 2011·Application pending·0 cites
- 0931US9905719B2Multi-junction solar cell, photoelectric conversion device, and compound-semiconductor-layer lamination structureYOSHIDA HIROSHI·Filed 2012·Granted Feb 27, 2018·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →