Inventor · disambiguated record
Tadashi Terasaki
Also filed as: TERASAKI TADASHI
18 granted patents·5 pending applications·389 citations·filing 1999–2024
92Inventor score
Files withHITACHI INT ELECTRIC INC9KOKUSAI ELECTRIC CORP5TERASAKI TADASHI2TEXAS INSTRUMENTS INC2UEDA TATSUSHI2
Top patents by PatentIndex Score
23 records- 0198US9929005B1Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted Mar 27, 2018·345 cites·7 claims
- 0294US11905596B2Method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Feb 20, 2024·2 cites·12 claims
- 0387US9236242B2Substrate processing method and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2012·Granted Jan 12, 2016·6 cites·13 claims
- 0482US12195854B2Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Jan 14, 2025·0 cites·20 claims
- 0582US10192735B2Substrate processing method and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2017·Granted Jan 29, 2019·2 cites·15 claims
- 0679US8334215B2Substrate processing method and substrate processing apparatusUEDA TATSUSHI·Filed 2009·Granted Dec 18, 2012·5 cites·15 claims
- 0771US9754780B2Substrate processing method and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Sep 5, 2017·1 cites·13 claims
- 0868US9059229B2Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2013·Granted Jun 16, 2015·2 cites·7 claims
- 0968US8066894B2Substrate processing method and substrate processing apparatusUEDA TATSUSHI·Filed 2006·Granted Nov 29, 2011·2 cites·11 claims
- 1063US8084315B2Method of fabricating non-volatile semiconductor memory device by using plasma film-forming method and plasma nitridationYAMAMOTO KATSUHIKO·Filed 2009·Granted Dec 27, 2011·2 cites·10 claims
- 1160US11155922B2Method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Oct 26, 2021·0 cites·6 claims
- 1260US8071446B2Manufacturing method of semiconductor device and substrate processing apparatusTERASAKI TADASHI·Filed 2009·Granted Dec 6, 2011·3 cites·7 claims
- 1354US6730613B1Method for reducing by-product deposition in wafer processing equipmentTEXAS INSTRUMENTS INC·Filed 1999·Granted May 4, 2004·17 cites·13 claims
- 1448US2009253272A1Method for manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2009·Application pending·0 cites
- 1546US2021305045A1Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-transitory Computer-readable Recording MediumKOKUSAI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1643US7045447B2Semiconductor device producing method and semiconductor device producing apparatus including forming an oxide layer and changing the impedance or potential to form an oxynitrideHITACHI INT ELECTRIC INC·Filed 2003·Granted May 16, 2006·2 cites·21 claims
- 1742US7795156B2Producing method of semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2005·Granted Sep 14, 2010·0 cites·7 claims
- 1840US9978653B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted May 22, 2018·0 cites·18 claims
- 1940US6794308B2Method for reducing by-product deposition in wafer processing equipmentTEXAS INSTRUMENTS INC·Filed 2000·Granted Sep 21, 2004·0 cites·6 claims
- 2036US2002139304A1Semiconductor manufacturing apparatusHITACHI INT ELECTRIC INC·Filed 2002·Application pending·0 cites
- 2135US2008096395A1Producing Method of Semiconductor DeviceTERASAKI TADASHI·Filed 2005·Application pending·0 cites
- 2235US2003219989A1Semiconductor device producing method and semiconductor device producing apparatusFiled 2003·Application pending·0 cites
- 2328US8178445B2Substrate processing apparatus and manufacturing method of semiconductor device using plasma generationHORIE TADASHI·Filed 2010·Granted May 15, 2012·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →